Millimeter-wave Radar Imaging via Optical Up-conversion
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Solution Overview
Problem
Conventional millimeter-wave (mmW) imaging systems are computationally intensive and require powerful digital signal processors, making them complex, expensive, and limited in portability and hand-held manipulation.
Innovation Solution
A mmW imaging system that converts backscatter radiation directly to visible light using an array of up-converter elements or a glow discharge device, eliminating the need for powerful DSPs and sophisticated image processing, and includes a photodetector array to produce electrical signals indicative of an optical image, with optional display and decoder for image display and RFID tag decoding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional DSP-based processing is used for mmW scan data, then imaging capability is achieved, but device complexity and cost increase significantly
Solution Approach 1:
The patent replaces the mechanical/computational signal processing system (DSP-based conventional processing) with an optical conversion system. The up-converter elements convert mmW radiation directly to visible light, and photodetectors convert light to electrical signals, eliminating the need for complex digital signal processing while maintaining imaging capability.
Solution Approach 2:
The patent changes the operating parameter domain from millimeter-wave frequencies to visible light frequencies through the up-conversion process. This parameter transformation allows the use of optical detection methods instead of complex RF signal processing, simplifying the overall system while preserving imaging functionality.
2Productivity
If powerful DSPs are used for mmW imaging, then processing capability is improved, but portability and hand-held manipulation are limited
Solution Approach 1:
The patent replaces heavy computational processing (requiring powerful DSPs) with direct optical conversion and detection. The up-converter elements and photodetector array perform the imaging function through physical processes rather than computational algorithms, dramatically reducing system weight and enabling portable, hand-held operation.
3Measurement precision
If conventional processing methods are used, then imaging accuracy is maintained, but cost increases
Solution Approach 1:
The patent replaces expensive computational processing infrastructure with a direct optical conversion system using up-converter elements and photodetectors. This physical conversion approach maintains imaging accuracy while eliminating the need for costly DSP hardware and software processing, making the system more cost-effective.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves efficient mmW imaging without the need for complex processing, enabling portable and cost-effective imaging of targets, including those obscured by non-transmissive barriers, with high resolution and ability to penetrate various materials.
Implementation Method 1
an array of up-converter elements configured to convert backscatter radiation received from the target directly to visible light
Implementation Method 2
The photodetector array is configured to produce electrical signals indicative of an optical image of the target
Implementation Method 3
a glow discharge device (GDD) comprising an array of GDD pixels... configured to convert backscatter radiation received from the target to visible light
Data Source
AI summary
A millimeter-wave (mmW) imaging system comprises a mmW source configured to transmit mmW radiation to a target and a mmW imaging device. The mmW imaging device comprises an array of up-converter elements configured to convert backscatter radiation received from the target directly to visible light. The up-converter array has a first surface and a second surface. The mmW imaging device also comprises a first focusing lens optically coupled to the first surface of the up-converter array and configured to direct backscatter radiation received from the target to the up-converter elements. The mmW imaging device further comprises an an array of photodetectors. The photodetector array has a first surface and a second surface. The first surface of the photodetector array is configured to receive visible light emitted by the up-converter elements. The photodetector array is configured to produce electrical signals indicative of an optical image of the target.


