Millimeter-wave antenna module with air dielectric gap

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Solution Overview

Problem

Current packaging concepts for millimeter-wave systems with integrated antennas are costly due to the need for specialized substrates and materials, leading to complex interconnect structures and inefficiencies in impedance bandwidth and thermal resistance, which are incompatible with mainstream production processes.

Innovation Solution

A millimeter-wave radio antenna module with a semiconductor die and integrated antenna on a substrate, utilizing a ball grid array to create an air dielectric gap between the antenna and the circuit board, providing a low thermal resistance path and simplifying interconnects, while using standard laminate materials for cost-effective production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If specialized low loss ceramic substrates and thin-film processes are used for antenna packaging, then impedance bandwidth and signal loss characteristics are improved, but manufacturing cost and device complexity increase significantly

Engineering Contradiction:

Improvesignal lossVSAvoidmanufacturing cost

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The patent changes the dielectric parameter from traditional ceramic materials to an air gap (dielectric constant approaching 1.0), which fundamentally alters the electromagnetic field distribution and reduces signal losses while enabling compatibility with standard PCB manufacturing processes

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent extracts the dielectric material from the antenna structure, replacing it with an air gap created by the BGA solder balls. This removes the lossy ceramic substrate while maintaining the necessary electrical insulation and mechanical support functions

Inventive Principle:

Principle #2Taking out (Extraction)

2Device complexity

If the antenna is integrated with the package using specialized substrates, then interconnect requirements are relaxed, but manufacturing cost and process complexity increase

Engineering Contradiction:

Improveinterconnect structureVSAvoidmanufacturing process

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

The BGA solder balls serve multiple functions simultaneously: they provide electrical interconnection between the die and substrate, mechanical support for the antenna structure, and create the air gap dielectric. This multi-functionality eliminates the need for separate specialized components

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the interconnect function with the antenna substrate function by integrating the antenna directly onto the standard PCB substrate, eliminating the need for separate specialized antenna substrates and their associated complex interconnect structures

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If standard laminate materials are used instead of specialized ceramics, then manufacturing cost decreases and ease of production increases, but thermal resistance and signal loss characteristics worsen

Engineering Contradiction:

Improvemanufacturing costVSAvoidthermal management

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The air gap acts as an intermediary thermal management solution, allowing heat to be dissipated through convection and radiation pathways while maintaining electrical insulation. This compensates for the lower thermal conductivity of standard laminate materials compared to specialized ceramics

Inventive Principle:

Principle #24Intermediary (Mediator)

4Loss of energy

If a ball grid array is used to create an air dielectric gap, then impedance bandwidth increases and parasitic effects are reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improveparasitic effectsVSAvoidair gap uniformity

Core Design Contradiction:

Loss of energyVSManufacturing precision

Solution Approach 1:

The BGA solder balls automatically self-align and self-adjust during the reflow soldering process, creating a uniform air gap through self-organizing behavior. This eliminates the need for precise pre-positioning and compensates for typical PCB manufacturing tolerances

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces parasitic effects, increases impedance bandwidth, and improves thermal management, enabling low-cost, efficient packaging for mm-wave communication, radar, and imaging systems with simplified interconnects and reduced signal loss.

Implementation Method 1

a ball grid array formed on a face of the antenna substrate for mounting the antenna module to a circuit board and configured to define an air dielectric gap between the antenna and an underlying substrate

Methodology Applied

Scientific EffectDielectric: Dielectric

Implementation Method 2

providing a low thermal resistance path

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8854277B2Millimetre-wave radio antenna module

Publication Date: 2014.10.07 NXP BV

AI summary

A millimeter-wave radio antenna module (600) comprising: an antenna substrate (603) having an antenna (602) provided on a face thereof; and a semiconductor die (601) comprising a wireless system IC, the die mounted on a face of the antenna substrate and configured to provide a signal to the antenna, wherein a ball grid array (605) is formed on a face of the antenna substrate for mounting the antenna module to a circuit board, the ball grid array being configured to define an air dielectric gap (606) between the antenna and the circuit board.