Multi-Plane mmWave Antenna Module With Central RF Bump Layout
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Solution Overview
Problem
The integration of millimeter wave (mmW) modules with multiple antenna arrays in wireless communication devices faces challenges due to increased complexity, space constraints, and performance losses, particularly in managing connections between substrates in different planes, which affect signal handling and thermal considerations.
Innovation Solution
A multi-sided mmW antenna module is designed with solder bump connections strategically placed to optimize performance by minimizing feedline losses and maximizing system efficiency, utilizing multiple antenna arrays in different planes with centralized placement on the largest ground plane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antenna arrays are integrated in different planes to enhance omnidirectional communication coverage, then communication performance is improved, but device complexity increases
Solution Approach 1:
The patent implements antenna arrays in multiple spatial planes (first plane, second plane, and third plane) to achieve omnidirectional communication coverage. This dimensional approach allows the system to capture signals from all directions by distributing antenna elements across different orientations and elevations, thereby improving adaptability while managing complexity through structured spatial arrangement.
Solution Approach 2:
The communication system is segmented into multiple independent antenna arrays, each disposed on different substrates and operating in different planes. This segmentation allows each array to be optimized for specific directional coverage while collectively providing omnidirectional capability, and enables independent design and fabrication of each array module.
2Shape
If antenna arrays are placed on separate substrates in different planes, then spatial distribution is improved, but connection complexity increases
Solution Approach 1:
The patent introduces connectors as intermediary components that physically and electrically couple the separate substrates holding different antenna arrays. These connectors serve as mediation points that simplify the connection architecture by providing standardized interfaces between substrates, thereby reducing the overall connection complexity despite the multi-plane spatial distribution.
Solution Approach 2:
Multiple antenna arrays on different substrates are merged into a single integrated communication system through the use of connectors and shared mmW circuitry. The arrays are electrically coupled to common RF integrated circuit bump placements, which consolidates the control and signal processing architecture, thereby reducing connection complexity while maintaining spatial distribution benefits.
3Reliability
If solder bump connections are centrally placed on the largest ground plane, then signal handling is improved, but space utilization is reduced
Solution Approach 1:
The patent places solder bump connections specifically on the largest ground plane with centralized positioning to optimize signal handling for that particular array. This local optimization ensures that the most critical connection points benefit from the best possible electrical characteristics (lowest impedance, best grounding), while other areas of the device can utilize space more freely for other components or antenna elements.
Data Source
AI summary
Aspects described herein include a first antenna array disposed on a first surface of a first substrate in a first plane, where the first antenna array comprises a plurality of antenna elements in a first configuration and a second antenna array disposed on a second substrate in a second plane, where the second plane is different than and nonparallel with the first plane, one or more solder bump connections disposed on the first substrate, a millimeter wave (mmW) circuitry connected to the one or more solder bump connections, and a connector physically coupling the second substrate to the first substrate, wherein the mmW circuitry is coupled via the one or more solder bump connections to the first antenna array, the connector, and the second antenna array.