mmWave Antenna Layout Around Cameras for Thinner Electronic Devices
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Solution Overview
Problem
The challenge of integrating mmWave antennas into electronic devices with integrated side and rear surfaces is exacerbated by the need to reduce free space loss and maintain a thin form factor, as conventional mounting methods increase device thickness and manufacturing costs.
Innovation Solution
The integration of mmWave antenna modules horizontally aligned with front and rear cameras within the electronic device, utilizing nonconductive materials to mitigate performance degradation and optimize space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of antenna elements is increased to improve mmWave antenna performance, then antenna gain increases, but the whole volume of the antenna increases making it difficult to obtain mounting space
Solution Approach 1:
The patent transitions from traditional parallel or vertical mounting arrangements to a horizontal mounting configuration where the mmWave antenna is disposed along the horizontal direction of the rear plate. This dimensional reconfiguration optimizes space utilization and reduces the overall antenna volume while maintaining the required number of antenna elements for high performance
2Volume of moving object
If the mmWave antenna is horizontally or vertically mounted to reduce antenna volume, then mounting space is obtained, but multiple antennas are required on left and right sides to form beam pattern toward front surface, increasing manufacturing cost
Solution Approach 1:
The patent merges multiple antenna elements into a single integrated mmWave antenna module that is horizontally disposed along the rear plate. This consolidation achieves the required beamforming capability through a unified structure rather than requiring separate antennas on left and right sides, thereby reducing manufacturing complexity and cost
3Reliability
If the rear plate is formed with nonconductive material to mitigate antenna performance degradation, then antenna performance is maintained, but the total thickness of the electronic device increases
Solution Approach 1:
The patent applies nonconductive material properties locally at the specific mounting position of the mmWave antenna on the rear plate, rather than forming the entire rear plate from nonconductive material. This localized approach maintains antenna performance where needed while minimizing the overall device thickness
Data Source
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Figure 3A
AI summary
The electronic device includes a cover window including a view area and a non-view area formed along edges of the view area and including a view portion formed in at least one area, a frame including a first structure and a second structure, one surface of the first structure including a nonconductive area including a window area and a conductive area surrounding the nonconductive area, a PCB disposed in the second structure, wireless communication circuitry, a first camera disposed in an area corresponding to the view portion of the second structure, a second camera disposed in an area of the second structure corresponding to the window area, a first antenna module configured to generate a first RF signal toward the cover window, and a second antenna module configured to generate a second RF signal toward the rear surface of the electronic device.