mmWave Antenna Device with Integrated RF and BB Modules
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Solution Overview
Problem
Current antenna devices for mmWave communication face challenges with increased attenuation of wireless signals due to integrated RF and BB modules, and heat generation issues, making it difficult to implement them in compact devices without separate heat-radiating structures.
Innovation Solution
The antenna device integrates RF and BB modules with radiating conductors and via holes for enhanced heat dissipation, allowing for compact design and stable operation without a separate heat-radiating structure, and enabling flexible installation in various devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the BB module is integrated with the RF module, then device compactness is improved, but signal attenuation increases
Solution Approach 1:
A ground via hole is introduced as an intermediary element between the BB module and RF module. This ground via hole serves as a mediator that provides a reference potential path, enabling the radiating conductor to maintain proper signal integrity while physically integrated with the BB module, thus reducing signal attenuation despite compact integration
Solution Approach 2:
The radiating conductor is designed with differentiated local properties: it has a first end with specific characteristics for signal radiation and a second end connected to the ground via hole for reference potential. This local quality differentiation allows the conductor to function effectively as both a signal carrier and a heat dissipation path within the compact integrated structure
2Device complexity
If the RF module is integrated with the BB module, then device complexity is reduced, but heat generation issues worsen
Solution Approach 1:
The radiating conductor is designed to perform multiple functions simultaneously: it radiates electromagnetic signals for wireless communication, conducts heat away from the RF circuit chip, and provides structural support within the integrated module. This multi-functionality reduces the need for separate heat dissipation components, simplifying the overall device structure while addressing heat generation issues
Solution Approach 2:
The ground via hole acts as an intermediary thermal path, providing a dedicated route for heat to transfer from the RF module to the ground plane. This intermediary structure enables efficient heat dissipation without requiring complex external heat sinks or thermal management systems
3Loss of energy
If the emitter is disposed adjacent to the RFIC, then transmission loss is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The radiating conductor is designed with specific local characteristics: its first end is positioned adjacent to the RFIC for optimal signal coupling and minimal transmission loss, while its second end extends toward the ground via hole to provide an efficient heat dissipation path. This localized structural differentiation simultaneously addresses both transmission loss and heat dissipation requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces signal attenuation and heat-related issues, enabling stable and compact antenna devices for mmWave communication, suitable for both mobile and large-size electronic devices.
Implementation Method 1
the first radiating conductors and the second radiating conductors are configured to have a resonant at the frequency of power supply signals provided from the RFIC
Implementation Method 2
a via hole for power supply and a via hole for ground which are formed in the first circuit board, wherein the via hole for power supply and the via hole for ground are arranged respectively at both ends of the first radiating conductor in a plan view
Data Source
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AI summary
An antenna device and an electronic device including the antenna device are provided. The antenna device includes a radio frequency (RF) module and a baseband (BB) module. The RF module includes first radiating conductors and a radio frequency integrated chip (RFIC) integrated with the first radiating conductors. The BB module includes second radiating conductors respectively corresponding to some of the first radiating conductors and a baseband integrated chip (BBIC) integrated with the second radiating conductors. The RF module may be combined with the BB module via a cable or be positioned facing the BB module to be electrically connected with the BB module.