mmWave Antenna Module Layout for Compact PCB Integration
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Solution Overview
Problem
The challenge of integrating an antenna module that generates and radiates radio frequency signals in mmWave frequency bands into the limited spaces of electronic devices is exacerbated by the increasing functional requirements and the need for high-frequency communication, making it difficult to secure space for such modules.
Innovation Solution
The solution involves a portable communication device with a first printed circuit board (PCB) hosting a communication processor, an intermediate frequency integrated circuit (IFIC), and a radio frequency integrated circuit (RFIC) that splits RF signals between a first and second antenna module using separate switches, each with its own antenna array, connected via flexible printed circuit boards (FPCBs).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If an antenna module for mmWave frequency bands is integrated into electronic devices, then high data transfer rate communication is achieved, but the device size increases and available space is reduced
Solution Approach 1:
The antenna module is divided into multiple independent antenna elements (first antenna, second antenna, third antenna, fourth antenna) that can be separately controlled and configured. This segmentation allows the system to achieve mmWave communication capabilities while optimizing the spatial arrangement to minimize the overall device footprint.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by positioning antenna elements on different surfaces and orientations of the PCB board. The first and second antennas are positioned on a first surface while the third and fourth antennas are positioned on a second surface, effectively utilizing vertical space to reduce the horizontal footprint of the device.
2Reliability
If multiple antenna elements are used for mmWave communication, then communication reliability is improved, but the complexity of the antenna module increases
Solution Approach 1:
Multiple antenna elements are integrated into a single unified antenna module structure that shares common support infrastructure including the PCB board, mounting brackets, and control circuitry. This merging approach maintains communication reliability through multiple elements while reducing overall system complexity by consolidating shared components.
Solution Approach 2:
The antenna module is designed with universal components that serve multiple functions: the PCB board provides both structural support and electrical connectivity; the mounting bracket secures multiple antennas while providing mechanical stability; the control circuitry manages multiple antenna elements through standardized interfaces. This multi-functionality reduces the number of separate components needed.
3Volume of moving object
If antenna elements are positioned on different surfaces of PCB, then space utilization is optimized, but manufacturing complexity increases
Solution Approach 1:
The antenna module is segmented into distinct groups positioned on different surfaces: first and second antennas on the first surface, third and fourth antennas on the second surface. Each surface group can be manufactured and tested independently before final assembly, reducing manufacturing complexity while achieving optimal three-dimensional space utilization.
Solution Approach 2:
The antenna elements are nested within a compact PCB structure where components on the second surface are positioned to utilize the vertical space above the first surface components. The mounting bracket and support structures are nested to provide mechanical support while minimizing the overall envelope size, making the compact multi-surface design manufacturable.
Data Source
AI summary
A mobile communication device includes a processor positioned on a first printed circuit board, a radio frequency integrated circuit (RFIC), and an antenna module. The antenna module includes a second printed circuit board, a first antenna and a second antenna positioned on the second printed circuit board, and a plurality of front-end chips positioned on the second printed circuit board. The plurality of front-end chips include a first front-end chip electrically connecting the RFIC and the first antenna, and a second front-end chip electrically connecting the RFIC and the second antenna.