Millimeter-Wave Antenna Array PCB Stack for Thermal Control
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Solution Overview
Problem
The controlling circuitry for two-dimensional antenna arrays, particularly at millimeter wave frequencies, has a large footprint compared to the antenna array itself, and designing a suitable interface between non-coplanar substrates is complex, posing challenges in design and manufacture.
Innovation Solution
A two-dimensional antenna array is formed across multiple printed circuit boards (PCBs) with linear arrays of dipole antenna elements, each PCB supporting beamforming circuitry and thermal dissipation structures, and includes orthogonal orientations and varying thicknesses to accommodate different antenna elements and components, reducing the need for complex interfaces and improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the controlling circuitry is integrated on the same substrate as the antenna array, then the footprint is reduced, but the thermal management becomes difficult and the design complexity increases
Solution Approach 1:
The system is divided into separate components: the antenna array substrate and the controlling circuitry substrates are physically separated. The antenna array remains on its own substrate while the controlling circuitry is distributed across multiple separate substrates positioned at different locations, allowing independent thermal management for each component.
Solution Approach 2:
The controlling circuitry substrates are positioned in three-dimensional space around the antenna array substrate rather than being coplanar with it. This spatial distribution across multiple dimensions allows for better thermal separation while maintaining functional integration, enabling independent cooling paths for each substrate.
2Adaptability or versatility
If the antenna array substrate is positioned at an angle to the PCBs, then the spatial arrangement is optimized, but the interface complexity increases
Solution Approach 1:
The system employs adjustable and reconfigurable connections between substrates. The angled positioning of PCBs relative to the antenna array substrate allows for flexible spatial arrangement, and the interface design accommodates various angular configurations through adaptable connection mechanisms.
Solution Approach 2:
Connection interfaces and transition structures serve as intermediaries between the antenna array substrate and the angled PCBs. These intermediary components simplify the interface by providing standardized connection points and transition structures that handle the angular relationship, reducing the overall system complexity.
3Temperature
If multiple separate substrates are used for controlling circuitry, then the thermal management is improved, but the manufacturing complexity increases
Solution Approach 1:
The controlling circuitry is segmented across multiple separate substrates that can be manufactured independently using standard PCB fabrication processes. Each substrate can be produced separately with optimized manufacturing parameters, then assembled into the final configuration, simplifying the overall manufacturing process.
Solution Approach 2:
Multiple separately manufactured substrates are combined through standardized assembly processes. The interfaces between substrates are designed to accommodate normal manufacturing tolerances, allowing independently manufactured components to be assembled together without requiring ultra-precise alignment or specialized manufacturing processes.
Data Source
AI summary
An antenna array may include a plurality of printed circuit boards (PCBs) oriented in a stacked arrangement, parallel to and spaced apart from one another. Each of the PCBs may include a linear array of antenna elements, which cooperate with the linear arrays of antenna elements on other PCBs to form a two-dimensional array of antenna elements. The PCBs may be supported at one end by a common backplate in a cantilevered manner, with the linear arrays of antenna elements located near the free end of the PCBs. The PCBs may include a thicker portion and a thinner portion, and the thinner portion may include a heat sink or other thermal dissipation structure.