Millimeter-Wave Antenna Module Layout for Low-Loss RF Integration
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Solution Overview
Problem
Conventional antenna arrays for millimeter wave applications require expensive, low-yield circuit boards with unbalanced metal density and dielectric thickness, making them difficult to test and incapable of achieving regulatory compliance.
Innovation Solution
Antenna modules with a logic die and radio frequency front-end die closer to the antenna patch than the logic die, utilizing separate fabrication and assembly of IC packages, with an antenna board design that includes a radio frequency transmission structure and separate fabrication, incorporating shielding and improved dielectric materials, and a radio frequency transmission structure, and separate fabrication, and incorporating a shielding mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional antenna arrays use traditional circuit boards with unbalanced metal density and dielectric thickness, then manufacturing complexity increases and yield decreases, but antenna performance and regulatory compliance cannot be achieved
Solution Approach 1:
The invention divides the antenna system into separate modules: antenna patches mounted on a substrate, and IC packages (containing power amplifiers and other RF components) mounted separately on the same or adjacent substrate. This segmentation allows each component to be optimized and manufactured independently using standard PCB and IC packaging processes, then assembled together, thereby achieving high performance while simplifying manufacturing and improving yield compared to monolithic integrated approaches.
2Reliability
If conventional antenna arrays use expensive, low-yield circuit boards, then manufacturing cost increases, but regulatory compliance and performance requirements cannot be met
Solution Approach 1:
By separating the antenna function (patches on substrate) from the RF circuitry function (IC packages), the invention enables each to be manufactured using cost-effective, high-yield standard processes. The antenna patches can be fabricated using conventional PCB techniques, while IC packages use established semiconductor manufacturing. This eliminates the need for expensive, low-yield custom circuit boards while achieving regulatory compliance through optimized component placement and shielding.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for both antenna patches and IC packages, provides electrical interconnections between components, and can incorporate grounding and shielding structures. This multi-functionality reduces the need for specialized expensive circuit boards while meeting all performance and compliance requirements.
3Loss of energy
If IC packages are integrated closer to antenna patches, then power loss decreases and efficiency improves, but device complexity increases
Solution Approach 1:
The invention places IC packages in close proximity to antenna patches on the same substrate plane (two-dimensional arrangement), rather than stacking them vertically or using complex three-dimensional integration. This close planar placement minimizes the length of interconnect traces, reducing power loss and improving efficiency, while maintaining relatively simple device structure and assembly processes.
Data Source
AI summary
Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.