Millimeter-Wave Antenna Package Structure for Precise RFIC Spacing
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Solution Overview
Problem
Conventional PC board processes fail to precisely control the distance between high-frequency antennas and RFICs, leading to reduced efficiency due to surface roughness of transmission copper wires and warpage issues during multi-layer redistribution structure manufacturing.
Innovation Solution
A millimeter-wave antenna module package structure with a multi-layer redistribution structure is created by separately manufacturing groups of circuit structures on temporary carriers and assembling them, using conductive vias and underfills to connect and secure the layers, reducing warpage and improving precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional PC board process is used to manufacture multi-layer redistribution structure, then the manufacturing process is simple and continuous, but the distance between antenna and RFIC cannot be precisely controlled and the transmission copper wire surface becomes rough
Solution Approach 1:
The patent divides the multi-layer redistribution structure into multiple separate groups of circuit structures, each manufactured independently on temporary carriers. This segmentation allows precise control of the antenna-IC distance in each group while avoiding the surface roughness issues of continuous PC board etching processes.
Solution Approach 2:
The patent performs preliminary manufacturing of circuit structures on temporary carriers before final assembly. This preliminary action enables precise distance control and smooth copper wire surfaces to be established before the structures are joined together, avoiding the problems that arise in continuous manufacturing.
2Ease of manufacture
If conventional PC board etching process is used, then the manufacturing process is straightforward, but the transmission copper wire surface becomes roughened
Solution Approach 1:
The patent segments the manufacturing process into separate steps on temporary carriers, avoiding the aggressive etching process that roughens copper wires in conventional PC board manufacturing. Each circuit structure group is manufactured independently with controlled copper deposition.
Solution Approach 2:
The patent uses temporary carriers as intermediary substrates during the manufacturing process. These carriers provide a controlled environment for circuit structure formation that preserves copper wire surface smoothness, unlike conventional PC board etching processes.
3Stability of the object's composition
If multi-layer redistribution structure is manufactured continuously, then the structure is integrated, but warpage occurs during manufacturing
Solution Approach 1:
The patent divides the multi-layer structure into separate manufacturable groups that are produced independently on temporary carriers. This segmentation prevents warpage during manufacturing while maintaining structural integrity through controlled assembly with joints and underfills.
Solution Approach 2:
The patent employs underfills and carefully designed joint structures as compensatory measures before final assembly. These elements cushion and compensate for potential warpage and stress, ensuring structural stability when the separate circuit structure groups are joined together.
Data Source
AI summary
A millimeter wave antenna module package structure includes a first group of circuit structure, a second group of circuit structure, and a plurality of joints. The first group of circuit structure includes at least one first circuit layer and a plurality of first conductive connectors, and the at least one first circuit layer includes an antenna pattern. The second group of circuit structure includes a plurality of second circuit layers and a plurality of second conductive connectors. The joints are disposed between the first group of circuit structure and the second group of circuit structure. The joints are connected to the first conductive connectors and the second conductive connectors, such that the first group of circuit structure is electrically connected to the second group of circuit structure to form a multi-layer redistribution structure. A manufacturing method of the millimeter wave antenna module package structure is also provided.