Integrated Millimeter Wave Antenna and Transceiver on Substrate
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Solution Overview
Problem
Existing semiconductor structures face challenges in effectively capturing millimeter wave signals due to signal attenuation and impedance mismatch issues between antennas and semiconductor chips, leading to inefficient signal capture and transmission.
Innovation Solution
A semiconductor structure integrating a millimeter wave antenna, a reflector plate, and a transceiver on a substrate, where the antenna is formed in a dielectric layer on the front side and the reflector plate is connected to through-substrate vias on the backside, with a quarter-wavelength spacing to enhance radiation efficiency, and through-substrate trenches filled with dielectric material to reduce the effective dielectric constant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a millimeter wave antenna is attached to a semiconductor chip through C4 pad or wirebond pad, then the antenna can be connected to the chip, but impedance mismatch occurs at the interface leading to signal loss
Solution Approach 1:
The patent merges the antenna structure with the semiconductor chip by forming the antenna directly on the chip substrate using integrated circuit fabrication techniques. The antenna is created as part of the chip structure itself rather than being a separate component attached through pads or wirebonds, eliminating the interface impedance mismatch problem entirely.
Solution Approach 2:
The patent introduces an intermediary ground structure between the antenna and the chip substrate that serves as an impedance matching layer. This ground structure with specific geometry and positioning acts as a mediator to transform the impedance between the antenna and the chip interface, reducing reflections and improving signal transfer.
2Ease of manufacture
If the antenna is incorporated into a wiring level dielectric material layer on a semiconductor chip, then integration is achieved, but the distance between antenna and reflector plate is insufficient leading to poor signal capture efficiency
Solution Approach 1:
The patent moves the antenna from the traditional planar wiring level dielectric layer into the vertical dimension by forming it through the substrate thickness. The antenna extends in the z-direction (vertical) rather than only in the x-y plane, allowing sufficient distance between the antenna and reflector plate while maintaining compact footprint and achieving proper quarter-wavelength spacing.
Solution Approach 2:
The patent nests the antenna structure within the semiconductor substrate itself, utilizing the substrate thickness to provide the required antenna-reflector plate spacing. The antenna is embedded in the substrate volume rather than being placed on the surface, effectively using the substrate as the spacing medium between antenna and reflector plate.
3Ease of manufacture
If conventional metal wiring structure thickness is used (several microns to 20 microns), then manufacturing is straightforward, but there is insufficient volume to incorporate a functional reflector plate
Solution Approach 1:
The patent segments the reflector plate into multiple conductive layers formed at different depths within the substrate. Rather than requiring a single thick metal layer, the reflector function is achieved through stacked conductive planes that collectively provide the necessary reflective surface area and volume, enabling proper reflector functionality within conventional substrate thicknesses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the radiation efficiency and directionality of millimeter wave signal capture and transmission, minimizing signal loss and aligning the reflector plate for enhanced structural integrity and signal routing.
Implementation Method 1
Millimeter waves refer to electromagnetic radiation having a wavelength range from about 1 mm to about 10 mm
Implementation Method 2
The reflector plate is connected to the through substrate via, and is formed on the backside of the semiconductor substrate. The separation between the reflector plate and the antenna is about a quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna
Implementation Method 3
An array of through substrate trenches may be formed and filled with a dielectric material to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency
Data Source
AI summary
A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is formed on a front side of a semiconductor substrate. At least one through substrate via provides electrical connection between the transceiver and the backside of the semiconductor substrate. The antenna, which is connected to the transceiver, is formed in a dielectric layer on the front side. The reflector plate is connected to the through substrate via, and is formed on the backside. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate trenches may be formed and filled with a dielectric material to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency.