PCB Mm-Wave Power Divider With Embedded Load for Channel Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current power dividers for mm-wave antenna arrays face challenges in achieving high isolation between channels, low side lobes, and compact design, particularly for frequencies above 80 GHz, due to the limitations of existing termination loads and manufacturing complexities in multilayer PCBs.
Innovation Solution
A mm-wave signal power divider with an embedded termination load is implemented on a PCB, featuring an input arm, two output arms, and a termination load integrated into the PCB layers, utilizing electromagnetic coupling between feedlines and a resonator patch with a resistive material to absorb parasitic signals, allowing for compact and efficient power distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional termination loads are used in power dividers for mm-wave antenna arrays, then channel isolation can be improved, but device complexity and manufacturing difficulty increase significantly
Solution Approach 1:
The patent combines the termination load function with the power divider structure by integrating a resistive sheet directly into the PCB substrate. This merging eliminates the need for separate termination components and complex multilayer structures, achieving both channel isolation and manufacturing simplicity through a unified planar design where the resistive sheet serves as both the termination element and part of the power distribution network
Solution Approach 2:
The patent extracts the termination load function from traditional bulky three-dimensional components and represents it through a simplified two-dimensional resistive sheet pattern on the PCB. This extraction transforms the complex spatial arrangement of termination elements into a planar configuration that maintains isolation performance while dramatically reducing structural complexity and easing manufacturing
2Volume of moving object
If compact power divider design is implemented in multilayer PCBs, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent transitions from three-dimensional multilayer PCB structures to a two-dimensional planar configuration by implementing the termination load and power divider functions on a single PCB layer using a resistive sheet. This dimensional reduction simplifies the manufacturing process by eliminating the need for precise alignment across multiple layers, thereby reducing fabrication tolerance requirements while achieving compact form factor
Solution Approach 2:
The patent replaces complex mechanical assembly of multilayer PCB structures with a simplified planar resistive sheet configuration. By substituting the mechanical stacking and alignment of multiple layers with a single-layer resistive pattern, the design achieves compactness without imposing stringent mechanical precision requirements on the manufacturing process
3Speed
If frequencies above 80 GHz are used in mm-wave systems, then data transmission speed is improved, but signal loss and atmospheric absorption increase
Solution Approach 1:
The patent converts the harmful effect of parasitic signals and reflections at high frequencies into beneficial energy dissipation by using the resistive sheet to absorb these unwanted signals. The resistive sheet transforms the harmful high-frequency parasitic energy into heat, preventing it from degrading the main signal while allowing the system to operate at beneficial frequencies above 80 GHz with improved data transmission speed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The power divider achieves low side lobes, expanded scanning sectors, and improved reliability and speed of wireless signal transmission by effectively absorbing parasitic signals, ensuring high efficiency and compact dimensions.
Implementation Method 1
utilizing electromagnetic coupling between feedlines and a resonator patch with a resistive material to absorb parasitic signals
Implementation Method 2
a resonator patch with a resistive material to absorb parasitic signals
Implementation Method 3
absorb parasitic signals
Data Source
AI summary
The present disclosure relates to a 5G communication system or a 6G communication system for supporting higher data rates beyond a 4G communication system such as long term evolution (LTE). The present invention relates to an mm-wave signal power divider implemented on a PCB that includes an input arm, two output arms and a termination load embedded into the PCB, wherein each power divider arm includes a feedline having impedance Z0; each power divider output arm further includes a main power divider branch and an additional power divider branch; the main power divider branch connects the input arm feedline and the output arm feedline and has a length multiple of ˜λε/4; the additional power divider branch extends from the point of connection of the main power divider branch with the output arm feedline to the symmetry plane of the termination load and has a length multiple of ˜λε/2; additional power divider branches are connected in the symmetry plane of the termination load.