Millimeter Wave Wireless Interconnect Asynchronous Modulation
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Solution Overview
Problem
On-chip interconnects for multi-processor chips and network-on-a-chip face limitations in bandwidth, power, and latency, and existing wireless data transmission methods using on-chip antennas are complex and power-consuming due to the need for phase and frequency synchronous modulation schemes.
Innovation Solution
A millimeter wave wireless interconnect using asynchronous modulation and differential signaling, which allows for high data rate capability and eliminates the need for power-hungry components like phase lock loops, by employing on-chip or bond-wire dipole antennas for short-range communication, enabling multiple parallel communication links and reducing antenna size and design complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If phase and frequency synchronous modulation schemes (e.g., BPSK) are used for wireless data transmission, then data transmission capability is achieved, but architecture complexity and power consumption increase
Solution Approach 1:
The patent changes the modulation parameter from synchronous schemes (BPSK requiring phase and frequency locking) to asynchronous amplitude shift keying (ASK). This parameter change eliminates the need for complex phase lock loops and frequency synchronization circuits, thereby reducing architecture complexity while maintaining data transmission capability
Solution Approach 2:
The patent extracts and removes the power-hungry synchronous modulation components (phase lock loops, frequency synthesizers) from the system by adopting asynchronous modulation. This leaves only the essential amplitude modulation/detection circuits, significantly simplifying the architecture
2Measurement precision
If phase lock loops and synchronous modulation circuits are used, then coherent demodulation is achieved, but power consumption increases
Solution Approach 1:
The patent removes the power-consuming phase lock loop and frequency synchronization circuits by adopting asynchronous amplitude shift keying. The system achieves sufficient demodulation accuracy through simple envelope detection or peak detection circuits that consume minimal power compared to synchronous modulation schemes
Solution Approach 2:
The patent replaces expensive and power-hungry synchronous modulation components with simple, low-cost amplitude modulation circuits. The trade-off accepts reduced modulation complexity in exchange for dramatically lower power consumption, suitable for short-range interconnect applications
3Productivity
If millimeter wave frequencies are used for wireless communication, then data rate increases to tens of Gbps, but antenna size and design complexity decrease
Solution Approach 1:
The patent changes the operating frequency parameter to millimeter wave range (30-300 GHz), which provides sufficient bandwidth to achieve tens of Gbps data rates. At these frequencies, the wavelength is short enough that simple on-chip or bond-wire dipole antennas become practical, reducing antenna design complexity compared to lower frequency implementations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves high data rates of tens of Gbps with low power consumption and scalability, as it eliminates the need for carrier regeneration and PLL circuitry, while providing a manufacturable and cost-effective solution for short-reach wireless communication links.
Implementation Method 1
a carrier signal at specified frequencies, which are millimeter-wave frequencies, is modulated with an input data stream to generate a modulated carrier signal that is transmitted wirelessly
Implementation Method 2
The receiver receives the radiated carrier signal, amplifies the received carrier signal, and converts the amplified carrier signal by demodulation to a base-band signal
Data Source
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Figure 3A
AI summary
A millimeter wave wireless (M2W2) interconnect is used for transmitting and receiving signals at millimeter-wave frequencies for short-range wireless communication with high data rate capability. The transmitter and receiver antennae may comprise an on-chip differential dipole antenna or a bond wire differential dipole antenna. The bond wire differential dipole antenna is comprised of a pair of bond wires connecting between a pair of pads on an integrated circuit (IC) die and a pair of floating pads on a printed circuit board (PCB).