Millimeter-Wave Interposer Transitions for Compact IC Packaging
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Solution Overview
Problem
Miniaturization of radiofrequency and microwave electronics is challenged by the need to couple signals from packaged components to external antenna structures, which often increases package size and introduces geometric constraints due to the integration of millimeter-wave launchers.
Innovation Solution
The use of an interposer with a waveguide structure and transition structure to integrate millimeter-wave energy within the interposer, allowing for compact package designs while maintaining compatibility with conventional circuit board layouts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If millimeter-wave launchers are integrated into device packages or circuit boards, then coupling between integrated circuits and antenna structures is achieved, but package size increases and geometric constraints are introduced
Solution Approach 1:
The patent transitions millimeter-wave signal propagation from planar surfaces (circuit board traces) to three-dimensional waveguide structures. The waveguide extends vertically through the interposer substrate, enabling compact integration while maintaining effective coupling between the integrated circuit and external antenna structures without increasing lateral package dimensions
Solution Approach 2:
The patent introduces an interposer as an intermediary component between the integrated circuit and the circuit board. This interposer contains integrated waveguide structures that mediate the coupling of millimeter-wave signals, allowing the IC to be mounted in conventional packages while achieving reliable antenna coupling through the waveguide-mediated connection
2Reliability
If millimeter-wave launchers are integrated into device packages, then signal coupling is achieved, but geometric constraints are introduced
Solution Approach 1:
The patent divides the system into separate functional components: the integrated circuit in its package, the interposer with waveguide structures, and the circuit board with antenna connections. This segmentation allows each component to be optimized independently and assembled in flexible configurations, eliminating geometric constraints while maintaining signal coupling integrity
Solution Approach 2:
By moving waveguide structures into the vertical dimension within the interposer, the patent frees up lateral space on the circuit board, allowing greater flexibility in component placement and antenna design without compromising millimeter-wave signal coupling performance
3Ease of manufacture
If conventional circuit board layouts are used, then manufacturing simplicity is maintained, but integration of millimeter-wave launchers becomes difficult
Solution Approach 1:
The interposer acts as a mediator that bridges conventional circuit board layouts with advanced millimeter-wave launcher integration. The waveguide structures are embedded within the interposer rather than the circuit board itself, allowing conventional PCB manufacturing while achieving complex launcher functionality through the intermediary interposer component
Solution Approach 2:
The patent merges the functions of the launcher, waveguide, and interconnection structure into a single integrated interposer component. This consolidation simplifies the overall manufacturing process by reducing the number of separate components and assembly steps, while still achieving the complex function of millimeter-wave launcher integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reduced package sizes for millimeter-wave integrated circuits by allowing flexible component placement and integration with external antenna structures, reducing production costs and geometric constraints.
Implementation Method 1
a waveguide structure and a transition structure. The waveguide structure is formed integrally within the interposer between the top surface and the bottom surface of the interposer. The transition structure is configured to couple millimeter-wave energy received via one or more of the contact pads on the top surface into the waveguide structure and to direct millimeter-wave energy received at the top surface of the interposer to propagate away from the top surface of the interposer through the waveguide structure
Data Source
AI summary
A compact integrated circuit (IC) that outputs millimeter-wave energy can be assembled into a highly compact package that can utilize ultrasmall contacts and/or contacts arrange with nonstandard pitch. The millimeter-wave IC can be assembled onto an interposer that includes an integrated transition configured to be coupled to a millimeter-wave waveguide on a printed circuit board having contacts that have a standardized size and pitch.