Millimeter-Wave Interposer Transitions for Compact IC-to-Waveguide Coupling
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Solution Overview
Problem
Miniaturized integrated circuits for millimeter-wave communications face challenges in coupling signals to external antenna structures due to the need for larger antenna and waveguide integration, which increases package size and introduces geometric constraints, especially at higher frequencies like 30-300 GHz.
Innovation Solution
An interposer device with a transition structure and waveguide formed within it, allowing millimeter-wave energy to be coupled from integrated circuits to external antenna structures, reducing package size by separating the launcher from the IC package and enabling flexible placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If millimeter-wave integrated circuits are directly coupled to antenna structures, then signal coupling is achieved, but package size increases and geometric constraints are introduced
Solution Approach 1:
The system is divided into separate functional components: the millimeter-wave integrated circuit, the interposer with waveguide structure, and the external antenna. This segmentation allows each component to be optimized independently while maintaining compact overall packaging.
Solution Approach 2:
An interposer with integrated waveguide structure serves as an intermediary component between the millimeter-wave IC and external antennas. This mediator enables signal coupling while maintaining compact packaging by providing a dedicated pathway for millimeter-wave energy transmission.
2Reliability
If launcher is integrated in device package with millimeter-wave IC, then signal coupling is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The launcher functionality is extracted from the IC package and implemented as a waveguide structure on a separate interposer. This extraction simplifies the IC package design while maintaining signal coupling capability through the interposer's integrated waveguide.
Solution Approach 2:
The interposer acts as an intermediary that houses the waveguide structure, separating the launcher functionality from both the IC and the antenna. This mediation reduces complexity by providing a dedicated component for millimeter-wave energy routing.
3Reliability
If antenna structures are integrated with millimeter-wave ICs, then signal transmission is achieved, but production costs increase
Solution Approach 1:
By segmenting the system into IC, interposer, and antenna components, each can be manufactured using optimized processes for its specific function, reducing overall production costs while maintaining signal transmission reliability.
Solution Approach 2:
The interposer serves as a mediator that can be manufactured separately using standard PCB and waveguide fabrication techniques, avoiding the need for complex integrated manufacturing processes that would increase costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces package size, maintains compatibility with conventional circuit board layouts, and allows for more flexible system design by decoupling millimeter-wave components from the antenna structures, enhancing integration efficiency and reducing production costs.
Implementation Method 1
a waveguide structure and a transition structure. The waveguide structure is formed integrally within the interposer between the top surface and the bottom surface of the interposer. The transition structure is configured to couple millimeter-wave energy received via one or more of the contact pads on the top surface into the waveguide structure and to direct millimeter-wave energy received at the top surface of the interposer to propagate away from the top surface of the interposer through the waveguide structure
Data Source
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AI summary
A compact integrated circuit (IC) that outputs millimeter-wave energy can be assembled into a highly compact package that can utilize ultrasmall contacts and/or contacts arrange with nonstandard pitch. The millimeter-wave IC can be assembled onto an interposer that includes an integrated transition configured to be coupled to a millimeter-wave waveguide on a printed circuit board having contacts that have a standardized size and pitch.