Coaxial mmWave LC Filter Layout for Compact Inductive Coupling

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Solution Overview

Problem

Existing millimeter-wave (mmWave) band LC filters face challenges in achieving high performance and compact size, especially in the mmWave band where filters require efficient frequency selection and rejection.

Innovation Solution

The proposed mmWave band LC filter incorporates a coaxial resonator-type design with a pin at the center of a space surrounded by a via wall, and includes bridges interconnecting pins to enhance inductive coupling, thereby optimizing filter performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional filter structures are used in mmWave band, then basic filtering function is achieved, but filter performance and compact size cannot be simultaneously optimized

Engineering Contradiction:
Improvefilter performanceVSAvoidfilter size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent implements a nested structure where the pin is positioned at the center of the space surrounded by the via wall, creating a compact coaxial resonator configuration. This nesting approach allows multiple functional elements (pin, via wall, resonance space) to occupy overlapping spatial volumes, achieving high performance in a compact form factor suitable for mmWave band applications.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from planar filter structures to a three-dimensional configuration by stacking ground layers and creating vertical resonance spaces bounded by via walls. This dimensional change enables compact size reduction in the horizontal plane while maintaining filter performance through vertical electromagnetic resonance pathways.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If inductive coupling between pins is increased by reducing distance, then coupling strength improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improveinductive coupling amountVSAvoidpin positioning precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a blocking wall that selectively divides the resonance space into sub-spaces, creating localized regions around each pin. This local quality modification allows inductive coupling to be enhanced in specific areas through controlled electromagnetic field distribution, while the overall pin positioning tolerances remain manageable for manufacturing.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent optimizes the distance between the bridge and the first ground layer as a design parameter to control inductive coupling. By adjusting this distance and the bridge's cross-sectional area, the desired coupling strength is achieved without requiring extremely tight pin positioning tolerances, thus balancing performance with manufacturing feasibility.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If bridge cross-sectional area is increased to enhance inductive coupling, then coupling amount increases, but device complexity increases

Engineering Contradiction:
Improveinductive coupling amountVSAvoidbridge structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements a bridge with a cross-sectional area that is optimized to provide sufficient inductive coupling without being excessively large. The bridge dimensions are carefully selected to achieve the required coupling effect while maintaining simple structural form, avoiding unnecessary complexity in the bridge design.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves a compact, high-performance mmWave band LC filter with improved inductive coupling, enabling efficient frequency selection and rejection in the mmWave band, thus addressing the limitations of existing filters.

Implementation Method 1

a via wall having an end connected to the first ground layer and another end connected to the second ground layer, the via wall including a plurality of vias spaced apart from each other

Methodology Applied
Scientific EffectResonance: Resonance

Implementation Method 2

a blocking wall formed as a part of the via wall so as to protrude toward the interior of a resonance space defined by the first ground layer, the via wall, and the second ground layer, thereby dividing the resonance space into a plurality of sub-spaces

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Implementation Method 3

a plurality of pin electrodes, each being connected to the other end of a respective one of the plurality of pins, spaced apart from the second ground layer, and formed to face a portion of the second ground layer, a floating electrode spaced apart from the plurality of pin electrodes and formed to face portions of two pin electrodes among the plurality of pin electrodes

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS20250192745A1Millimeter-wave band LC filter
Publication Date: 2025.06.12 KOREA ELECTRONICS TECH INST
  • US20250192745A1 patent drawing
  • US20250192745A1 patent drawing
  • US20250192745A1 patent drawing

AI summary

Disclosed is a millimeter-wave (mmWave) band LC filter that is applied to a high-frequency signal in a mmWave band. The mmWave band LC filter includes a first ground layer providing an electrical ground, a second ground layer, a via wall having an end connected to the first ground layer and another end connected to the second ground layer, a blocking wall dividing a resonance space into sub-spaces, holes formed in the second ground layer to open the sub-spaces, pins connected to the first ground layer while passing through the holes, pin electrodes connected to the pins and spaced apart from the second ground layer while facing a portion of the second ground layer, a floating electrode spaced apart from the pin electrodes while facing portions of two of the pin electrodes, and input/output terminals connected to the pin electrodes or the floating electrode and configured to receive and output signals.