Millimeter Wave Package Using Embedded Waveguide I/O
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Solution Overview
Problem
Current electronic packaging solutions for millimeter wave semiconductor dies face challenges such as high electrical losses and size increases due to the use of Surface Mount Technology (SMT) and waveguide interfaces, which are costly and complex, especially above 50 GHz frequencies.
Innovation Solution
A novel electronic packaging system utilizing common Printed Circuit Board (PCB) technology with a simple metal lid, incorporating a single layer of organic dielectric laminate for low-loss high-frequency signal transmission and heat dissipation, and allowing for standard SMT connections, waveguide interfaces, and versatile semiconductor die attachment methods like wire bonds and solder bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If waveguide interface is used for high frequency signals, then electrical loss is reduced, but package size increases and manufacturing complexity increases
Solution Approach 1:
The patent embeds the waveguide interface within the multilayer circuit board structure itself, nesting the high-frequency signal path inside the board layers rather than requiring external waveguide components. This allows low-frequency signals and high-frequency signals to coexist within the same package volume, with the waveguide transition integrated into the board's internal structure.
Solution Approach 2:
The patent transitions from a two-dimensional surface mount approach to a three-dimensional internal routing approach by using plated-through holes and internal signal layers. The waveguide interface is formed through vertical plated-through holes that extend through multiple board layers, utilizing the Z-dimension to achieve compact high-frequency signal transmission without increasing the package's footprint.
2Loss of energy
If waveguide interface is used for high frequency signals, then electrical loss is reduced, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated structure: the multilayer circuit board simultaneously provides mechanical support, low-frequency signal routing, high-frequency waveguide transmission, and thermal management. The plated-through holes serve dual purposes as both mechanical vias and waveguide signal paths, eliminating the need for separate waveguide components and reducing manufacturing complexity.
Solution Approach 2:
The multilayer circuit board is designed as a universal platform that handles both low-frequency digital signals and high-frequency millimeter-wave signals through its different layers and plated-through hole configurations. The same structural elements (plated-through holes, dielectric layers) serve multiple functions including signal transmission, mechanical support, and thermal conduction.
3Ease of manufacture
If SMT package is used for mounting, then ease of manufacture is improved, but electrical loss increases at high frequencies
Solution Approach 1:
The patent segments the signal transmission paths into distinct frequency domains: low-frequency signals travel through conventional external traces on the board surface, while high-frequency millimeter-wave signals are routed through internal plated-through holes that form waveguide structures. This segmentation allows each signal type to use the optimal transmission medium, minimizing electrical loss for high-frequency signals while maintaining SMT manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, cost-effective packaging system with low electrical losses and efficient heat dissipation, enabling the transmission of both low and high-frequency signals without the need for cumbersome screw connections, thus addressing the limitations of existing technologies.
Implementation Method 1
A hybrid embodiment may be constructed from both wire bonds and bumps. The assembly process uses a common pick and place technology and heat is dissipated directly to an exposed pad at the bottom of the package. In one embodiment, the electronic package comprises a single layer of organic dielectric laminate that exhibits low loss at high frequencies
Implementation Method 2
The assembly process uses a common pick and place technology and heat is dissipated directly to an exposed pad at the bottom of the package
Data Source
AI summary
A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.