Millimeter Wave Module Packaging with Shielded Signal Paths
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Solution Overview
Problem
Current wafer level packaging for millimeter wave devices is expensive and prone to interference due to high frequency signals, with traditional methods not effectively preventing cross-interference between devices and signal lines, and requiring complex design evaluations with the use of electromagnetic bandgap structures.
Innovation Solution
The solution involves forming guided signal paths in a silicon substrate using a silicon wafer level packaging process, including patterned through-silicon vias and metallization layers, which are combined with a silicon package lid to create a shielded signal line structure that minimizes leakage and interference by forming air gaps around semiconductor devices and using grounded vias to act as shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wafer level packaging is used for millimeter wave devices, then the packaging process is simple, but cross-interference between devices and signal lines occurs due to high frequency signals
Solution Approach 1:
The packaging structure is segmented into multiple functional layers including a carrier substrate, a packaging substrate with through-vias, and a lid substrate. This segmentation allows each layer to perform specific functions: the carrier substrate provides mechanical support, the packaging substrate creates shielded signal paths through grounded vias, and the lid substrate provides additional shielding. By dividing the packaging into these segments, the patent eliminates cross-interference while maintaining signal integrity for millimeter wave devices.
Solution Approach 2:
The patent introduces an intermediary packaging substrate between the carrier substrate and the lid substrate. This intermediary layer contains through-vias that are connected to ground planes, creating a shielded environment for the millimeter wave devices. The intermediary packaging substrate acts as a mediator that blocks electromagnetic interference while allowing signal transmission through controlled impedance paths, thereby resolving the cross-interference problem.
2Object-affected harmful factors
If electromagnetic bandgap structures are added to reduce signal emission, then cross-interference decreases, but design complexity and evaluation cycle increase
Solution Approach 1:
The patent extracts the electromagnetic shielding function from complex electromagnetic bandgap (EBG) structures and implements it through a simpler packaging substrate design. By removing the need for EBG structures and replacing them with a packaging substrate containing grounded through-vias and air gaps, the patent reduces signal emission while significantly decreasing design complexity. The shielding function is achieved through the physical packaging structure rather than through complex periodic EBG patterns.
Solution Approach 2:
The patent replaces expensive and complex electromagnetic bandgap structures with a simpler, more cost-effective packaging substrate design. The packaging substrate uses standard through-via technology and air gap formation, which are simpler and more economical to manufacture than EBG structures. This substitution maintains the function of reducing signal emission while lowering design and manufacturing complexity.
3Reliability
If millimeter wave devices are packaged to protect from environment, then device protection is achieved, but interference between devices and signal lines increases
Solution Approach 1:
The patent applies local quality by creating regions with different electromagnetic properties within the packaging structure. The packaging substrate contains localized air gaps around millimeter wave devices and grounded through-vias at specific locations. These local modifications create shielded zones that protect devices from environmental factors while simultaneously blocking interference between devices and signal lines. The air gaps provide both mechanical protection and electromagnetic shielding in localized regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces interference between devices and transmission lines, eliminates the need for electromagnetic bandgap structures, and provides a cost-effective high-performance packaging solution for millimeter wave modules by creating shielded signal paths that minimize signal leakage.
Implementation Method 1
the packaging portion and the carrier portion form an air gap around the semiconductor device... the lid portion and the carrier portion form an first air gap around the first semiconductor device... using grounded vias to act as shielding
Data Source
AI summary
A module, which in one embodiment may be a packaged millimeter waver module, includes a semiconductor lid portion; a packaging portion attached to the lid portion, wherein the packaging portion comprises a plurality of vias, a carrier portion, wherein a first semiconductor die is attached to the carrier portion, the packaging portion is attached to the carrier portion so that the packaging portion is over the carrier portion and the semiconductor die is within an opening in the packaging portion, and the lid portion and the carrier portion form an first air gap around the first semiconductor device.