Millimeter-Wave PCB Connector Layout for Lower Insertion Loss
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Solution Overview
Problem
The existing connectors for connecting antennas and a transceiver circuit in a millimeter-wave band experience significant insertion loss due to radiation by vertical vias, which increases with the length of the vertical connections.
Innovation Solution
The implementation of a multilayered printed circuit board (PCB) configuration with ground patterns and signal transmission lines, where ground pads and signal vias are strategically positioned to reduce radiation and insertion loss, including the use of circular ground pads connected by narrower ground lines and signal lines with specific lengths to optimize RF signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If vertical connections are used to connect antennas and transceiver circuit, then device integration is improved, but insertion loss increases due to radiation by vertical vias
Solution Approach 1:
The patent extracts the problematic vertical via structure from the connection path between antenna and transceiver circuit. By removing the vertical via that causes radiation loss, the design achieves low insertion loss while maintaining vertical integration through alternative means (coplanar waveguide structure on same PCB layer).
Solution Approach 2:
The patent transitions from a three-dimensional vertical via connection to a two-dimensional coplanar waveguide structure. The signal transmission is redirected to occur along the PCB surface using coplanar waveguides with ground patterns, eliminating the need for vertical vias in the signal path while maintaining compact vertical layout.
2Adaptability or versatility
If length of vertical vias is increased to accommodate vertical connection, then connection flexibility is improved, but insertion loss increases due to radiation
Solution Approach 1:
The patent removes the vertical via from the signal transmission path entirely. Instead of using vertical vias of varying lengths for connection flexibility, the design uses coplanar waveguides that travel along the PCB surface, eliminating radiation loss from vertical structures while maintaining connection adaptability through PCB routing flexibility.
Solution Approach 2:
The coplanar waveguide structure acts as an intermediary between the antenna and transceiver circuit connection points. Rather than directly connecting through vertical vias, the signal is mediated through the coplanar waveguide transmission line with associated ground patterns, which reduces radiation and insertion loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces insertion loss and radiation-related issues in millimeter-wave bands, enhancing the performance of connectors for antennas and transceiver circuits by optimizing circuit patterns around vertical connections.
Implementation Method 1
ground patterns constituting a ground vertical-connection between different layers... ground vias for the ground vertical-connection
Implementation Method 2
insertion loss increases due to radiation by the vertical vias
Implementation Method 3
signal transmission lines... to transmit Radio Frequency (RF) signals
Data Source
AI summary
An electronic device according to the present invention can comprise: a first multilayered printed circuit board (PCB) including a transmitting/receiving unit circuit; a second multilayered PCB including an antenna; and a connector for connecting the first multilayered PCB and the second multilayered PCB to each other, and thus the present invention provides a connector and an electronic device that are capable of reducing an insertion loss when an antenna and a transmitting/receiving circuit are vertically connected in a millimeter-wave band.