Millimeter-wave Active Antenna Unit Direct PCB Welding Interconnection
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Solution Overview
Problem
Conventional millimeter-wave active antenna units face high costs and limited frequency and stack layer compatibility due to expensive interconnection components and inadequate design for high-frequency applications.
Innovation Solution
A direct welding interconnection structure between multilayer PCBs, incorporating an impedance matching transformation branch and signal processing circuit, allows for cost-effective and reliable signal transmission across a wide range of frequencies and stack layers, omitting expensive components and enhancing integration and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If BGA ball planting is used for interconnection design between boards, then connection reliability is improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent replaces expensive BGA ball planting with a cost-effective PCB welding process using standard PCB materials and processes. The interconnection is achieved through copper foil layers and welding on PCB boards rather than expensive BGA components, significantly reducing manufacturing cost while maintaining adequate connection reliability for millimeter-wave applications.
Solution Approach 2:
The patent substitutes the mechanical BGA ball array system with a planar PCB welding interconnection system. Instead of using three-dimensional BGA components with solder balls, the design uses two-dimensional PCB trace routing and surface mounting, simplifying the interconnection mechanism and reducing costs.
2Ease of manufacture
If PCB welding process is used for interconnection, then manufacturing cost is reduced, but adaptability to high frequency and multiple stack layers is limited
Solution Approach 1:
The patent transitions from planar PCB routing to three-dimensional multilayer PCB stacking with vertical interconnections. By utilizing multiple PCB stack layers (e.g., 4-layer, 6-layer, 8-layer configurations) with through-hole vias and embedded conductors, the design achieves high-frequency signal transmission capability and adapts to various stack layer requirements while maintaining cost-effective PCB welding processes.
Solution Approach 2:
The patent optimizes PCB parameters including dielectric material selection, trace geometry, via dimensions, and layer stacking configurations to achieve impedance control and signal integrity for millimeter-wave frequencies. By adjusting these parameters, the PCB welding process becomes suitable for high-frequency applications across different stack layer configurations.
3Reliability
If expensive millimeter-wave interconnection components are used, then signal transmission quality is improved, but device complexity and cost increase
Solution Approach 1:
The patent integrates antenna elements, feeding networks, and interconnection structures into a unified PCB-based system. Instead of using separate expensive millimeter-wave components (axes, waveguides, etc.), the design combines these functions into integrated PCB traces, via structures, and embedded conductors, reducing component count and system complexity while maintaining signal transmission quality.
Solution Approach 2:
The PCB structure serves multiple functions simultaneously: it provides mechanical support, electrical interconnection, signal transmission, and impedance control. The same PCB layers and traces that provide structural integrity also serve as signal pathways, eliminating the need for dedicated expensive interconnection components and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves low-cost, reliable, and high-performance millimeter-wave active antenna units suitable for diverse frequencies and stack layers, with improved reliability and integration, while maintaining signal quality and reducing material costs.
Implementation Method 1
an impedance matching transformation branch, an impedance line being electrically connected to the signal processing circuit
Implementation Method 2
the second pad and the first pad being superposed and connected by welding
Data Source
AI summary
A millimeter-wave active antenna unit and an interconnection structure between PCBs is provided. The interconnection structure between PCBs comprises a mainboard and an AIP antenna module. The mainboard is a first multilayer PCB on which a signal transmission line and a first pad electrically connected to the signal transmission line are provided. The AIP antenna module is a second multilayer PCB on which a second pad, an impedance matching transformation branch, an impedance line and a signal processing circuit are provided. The mainboard and the AIP antenna module are interconnected by directly welding multiple PCBs.