Millimeter Wave Transceiver Interposer Antenna Integration
Solution Overview
Problem
Current millimeter wave transceiver systems face challenges in integrating antenna arrays on a single chip due to the large dimensions and separation requirements, leading to complex systems with long track lengths and potential stray radiations, making it impractical to assemble on an integrated circuit chip.
Innovation Solution
A millimeter wave transceiver system is designed with an interposer plate supporting an integrated circuit chip, antennas formed on the plate, and reflectors on a printed circuit board, where the antennas are surrounded by conductive tracks connected via bumps, forming a compact assembly that minimizes bulk and optimizes signal transmission and reception.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If antenna arrays are integrated on a single chip, then system compactness is improved, but chip dimensions become prohibitively large due to antenna size and separation requirements
Solution Approach 1:
The system is divided into separate functional modules: antenna arrays on a first substrate, processing circuits on a second substrate, and an interconnection structure linking them. This segmentation allows each component to be optimized independently, avoiding the need for a single large chip while maintaining system compactness through modular integration.
Solution Approach 2:
The patent transitions from planar integration on a single chip to three-dimensional modular stacking with multiple substrates connected via interconnection structures. This dimensional change enables vertical integration, reducing the horizontal footprint while maintaining functional integration.
2Area of stationary object
If antenna arrays are assembled on individual substrates, then chip area is reduced, but system complexity increases due to track lengths and signal processing requirements
Solution Approach 1:
An interconnection structure acts as an intermediary between the antenna substrate and processing substrate, providing standardized electrical connections and signal routing. This intermediary simplifies the overall system by encapsulating the complexity of inter-substrate connections in a dedicated component, making the system more manageable and easier to manufacture.
3Object-generated harmful factors
If track lengths between antenna elements are reduced, then stray radiations and interferences are minimized, but system assembly becomes more complex
Solution Approach 1:
By segmenting the system into separate substrates with antennas on one and processing circuits on another, the patent naturally limits track lengths within each substrate while using standardized interconnection structures for inter-substrate links. This segmentation maintains signal integrity by keeping individual track lengths short while preserving manufacturing simplicity through modular assembly.
Data Source
AI summary
A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.