Integrated mmWave and UWB Antenna Module Layout for Compact Devices
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Solution Overview
Problem
There is a challenge in designing compact wireless electronic devices that can efficiently cover multiple communications bands while minimizing space and manufacturing complexity, while also ensuring that antennas do not interfere with each other or device components and maintain satisfactory performance across various frequencies.
Innovation Solution
The integration of first and second phased antenna arrays and a triplet of ultra-wideband antennas on a single antenna module with a dielectric substrate, where the phased antenna arrays and ultra-wideband antennas are formed on the same module, with the phased arrays being interleaved within the gap between the ultra-wideband antennas, and a radio-frequency integrated circuit (RFIC) mounted using an interposer to reduce space and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antennas are incorporated into a wireless device, then coverage of communications bands is improved, but antenna interference and space requirements increase
Solution Approach 1:
The patent combines multiple antenna types (phased antenna arrays for millimeter wave and ultra-wideband antennas) onto a single antenna module with a common dielectric substrate and ground structure. This merging approach allows multiple antennas to coexist in a compact form factor while sharing common support structures, thereby reducing overall device space requirements and minimizing interference through integrated design
Solution Approach 2:
The patent utilizes three-dimensional positioning of antennas on the dielectric substrate, with phased antenna arrays and ultra-wideband antennas arranged in different spatial configurations and heights. This dimensional arrangement allows antennas to be closely spaced while maintaining proper isolation, enabling multi-band coverage without increasing the device's footprint
2Ease of manufacture
If phased antenna arrays and ultra-wideband antennas are formed on separate antenna modules, then manufacturing is simpler, but space consumption and interconnect requirements increase
Solution Approach 1:
The patent integrates phased antenna arrays and ultra-wideband antennas onto a single antenna module with a common dielectric substrate and ground structure. This consolidation eliminates the need for separate modules and reduces the number of interconnects required, thereby reducing space consumption while maintaining manufacturing feasibility through a unified design approach
3Volume of moving object
If antennas are placed closer together to reduce space, then device compactness is improved, but antenna interference increases
Solution Approach 1:
The patent implements local isolation structures such as ground plane partitions and dielectric barriers between adjacent antennas on the same module. These localized measures allow antennas to be placed in close proximity while maintaining proper electromagnetic isolation, enabling compact device design without sacrificing performance
Solution Approach 2:
The patent utilizes vertical spacing and three-dimensional positioning of antennas on the dielectric substrate, with different antenna types arranged at different heights and lateral positions. This spatial arrangement allows close lateral spacing for compactness while maintaining vertical separation to reduce interference
Data Source
AI summary
An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.