Millimeter-Wave Wireless Interconnect for Chip Package Communication
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Solution Overview
Problem
High-speed communication between chip packages in computer systems is limited by the traditional use of copper interconnects and optical fibers, which require physical space, precise alignment, and can generate heat, leading to reduced signal integrity and increased complexity in system design.
Innovation Solution
Implementing a millimeter-wave wireless interconnect that uses radio frequencies to transmit data between chip packages, eliminating the need for physical cables or fibers and allowing for smaller package size, reduced heat generation, and simplified alignment, while enabling high-data-rate connections without significant impact on package size or complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper interconnects are used for communication between chip packages, then data transmission can be achieved, but the signal path length increases and signal integrity deteriorates
Solution Approach 1:
The patent extracts the communication function from the physical copper interconnect medium and implements it through wireless millimeter-wave transmission. This removes the need for long copper traces through the socket and motherboard, directly addressing the signal integrity deterioration caused by extended path lengths.
Solution Approach 2:
The patent replaces the mechanical electrical connection system (copper interconnects through sockets and motherboards) with an electromagnetic wave-based wireless transmission system. This substitution eliminates the physical constraints of cable length and connection interfaces that degrade signal integrity.
2Speed
If flexible cables with multiple parallel conductors are used to connect chip packages, then a more direct path is achieved, but physical space is required and alignment precision is needed
Solution Approach 1:
The patent replaces the mechanical flexible cable system with wireless millimeter-wave transmission. This eliminates the need for precise physical alignment of cable connectors and removes the bulk of the cable assembly, achieving high-speed data transmission without the alignment precision requirements of mechanical systems.
3Length of stationary object
If optical fiber interface is used for longer distance communication, then data can be transmitted to remote chips, but the package size increases and heat generation occurs
Solution Approach 1:
The patent changes the transmission medium from optical fiber to wireless millimeter-wave propagation. This parameter change enables long-distance communication without the heat generation associated with optical fiber interfaces and eliminates the need for large package substrates required for optical connector integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The millimeter-wave wireless interconnect provides high-data-rate connections with reduced heat generation and complexity, allowing for more compact and scalable system designs, improved signal integrity, and easier maintenance and upgrading of components.
Implementation Method 1
a radio on the package substrate coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data
Implementation Method 2
transmit the modulated data to a radio on the system board
Implementation Method 3
a radio on the system board to receive the transmitted modulated data and to demodulate the received data
Data Source
AI summary
Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.