MnOx Adhesion Layer for Copper-Glass Bonding in 3D Interposers

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Copper does not adhere well to glass and glass ceramic materials, leading to reliability issues such as cracking and delamination, and creating a path for moisture and contaminants in applications like electrical interfaces and RF filters.

Innovation Solution

A method involving the deposition of a manganese oxide (MnOx) adhesion layer on glass or glass ceramic substrates, followed by annealing in a reducing atmosphere to enhance the adhesion of copper, which forms a gradient in the MnOx layer for better bonding with both glass and copper.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If copper is deposited directly onto glass or glass ceramic substrates, then the manufacturing process is simple, but the adhesion between copper and glass is poor leading to cracking and delamination

Engineering Contradiction:

Improveadhesion between copper and glassVSAvoidcomplexity of deposition process

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

An adhesion layer comprising manganese oxide (MnOx) is deposited between the glass substrate and copper to serve as an intermediary that enhances bonding. The MnOx layer chemically bonds to both the glass substrate and copper, creating strong adhesion where direct copper-glass bonding fails. This mediator layer prevents cracking and delamination while maintaining process simplicity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a composite structure consisting of glass substrate + manganese oxide adhesion layer + copper layer. This multi-material composite leverages the complementary properties of each material: glass provides structural integrity, MnOx provides chemical bonding capability to both substrates, and copper provides electrical conductivity. The composite structure resolves the adhesion problem by combining materials with compatible bonding characteristics.

Inventive Principle:

Principle #40Composite materials

2Reliability

If a hermetic seal between copper and glass is required, then reliability is improved, but achieving such seal is difficult due to poor copper-glass adhesion

Engineering Contradiction:

Improvehermetic seal qualityVSAvoiddifficulty of achieving hermetic seal

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The manganese oxide adhesion layer acts as a mediator that enables hermetic sealing by providing continuous chemical bonding between copper and glass. The MnOx layer fills and bonds to microscopic surface irregularities, creating a seamless interface that prevents moisture and contaminant ingress. This intermediary layer transforms the difficult copper-glass sealing problem into a manageable multi-layer bonding process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If the MnOx adhesion layer is annealed in a reducing atmosphere, then adhesion strength is improved, but the process temperature and time requirements increase

Engineering Contradiction:

Improveadhesion strength of MnOx layerVSAvoidenergy consumption during annealing

Core Design Contradiction:

StrengthVSUse of energy by stationary object

Solution Approach 1:

The patent optimizes annealing parameters (temperature, atmosphere composition, time) to achieve the desired MnOx reduction and adhesion enhancement with minimal energy input. By controlling the reducing atmosphere composition and annealing temperature, the process achieves effective MnOx layer modification without excessive energy consumption. The parameter optimization balances adhesion improvement with energy efficiency.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves superior adhesion of copper to glass, capable of passing a 5 N/cm tape test, ensuring reliability and preventing moisture ingress by forming a strong interface between the MnOx layer and copper.

Implementation Method 1

the adhesion layer is deposited by chemical vapor deposition or atomic layer deposition

Methodology Applied

Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Implementation Method 2

the adhesion layer is deposited by chemical vapor deposition or atomic layer deposition

Methodology Applied

Scientific EffectAtomic layer deposition:

Implementation Method 3

annealing the adhesion layer in a reducing atmosphere

Methodology Applied

Scientific EffectAnnealing: Annealing

Implementation Method 4

annealing the adhesion layer in a reducing atmosphere

Methodology Applied

Scientific EffectReduction: Reduction

Data Source

PatentUS20240140864A13D interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom

Publication Date: 2024.05.02 CORNING INC

AI summary

In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnOx) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.