Molybdenum Nitride Adhesion Layer for Copper TFT Conductive Lines
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Solution Overview
Problem
The adhesion between copper conductive lines and glass substrates in TFT array substrates is poor, leading to increased resistance values and manufacturing costs due to the use of adhesive layers, and diffusion issues between copper and silicon semiconductor layers.
Innovation Solution
The use of a molybdenum nitride layer as an adhesive between the copper conductive lines and glass substrates, combined with copper metal layers, which maintains low resistance values and similar etching properties, reducing manufacturing costs and preventing copper oxide formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive layer is added between copper conductive line and glass substrate to improve adhesion, then adhesion is improved, but resistance value increases and manufacturing cost increases
Solution Approach 1:
A molybdenum nitride layer is introduced as an intermediary between the copper conductive line and glass substrate. This intermediate layer provides both adhesion to the glass substrate and low electrical resistance, while also having similar etching properties to copper, thus resolving the contradiction between adhesion and resistance without requiring additional adhesive layers
Solution Approach 2:
The conductive line structure uses a composite material system combining molybdenum nitride and copper layers. The molybdenum nitride layer provides adhesion and low resistance, while the copper layer provides conductivity and etching compatibility, creating a composite structure that simultaneously satisfies multiple requirements
2Strength
If an adhesive layer is added between copper conductive line and glass substrate to improve adhesion, then adhesion is improved, but manufacturing cost increases
Solution Approach 1:
The molybdenum nitride layer serves as a multifunctional intermediary that provides adhesion, low resistance, and etching compatibility in a single layer, eliminating the need for separate adhesive layers and reducing manufacturing steps and costs
Solution Approach 2:
The molybdenum nitride layer performs multiple functions simultaneously: it acts as an adhesive layer for glass substrate bonding, maintains low electrical resistance, and provides etching compatibility with copper, reducing the need for multiple specialized layers and simplifying manufacturing
3Reliability
If copper conductive line is used to reduce resistance value, then resistance value is reduced, but adhesion to glass substrate deteriorates
Solution Approach 1:
The conductive line is segmented into multiple functional layers: a molybdenum nitride layer at the bottom for adhesion and low resistance, and a copper layer on top for conductivity and etching compatibility. This segmentation allows each layer to optimize for its specific function without compromising overall performance
Solution Approach 2:
The molybdenum nitride layer acts as an intermediary between the glass substrate and copper layer, providing the adhesion that copper lacks while maintaining low electrical resistance, thus enabling copper to be used for its conductivity benefits without suffering from poor adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances adhesion between copper conductive lines and glass substrates, maintains low resistance values, and prevents diffusion between copper and silicon, thereby reducing manufacturing costs and improving the overall performance of TFT array substrates.
Implementation Method 1
The molybdenum nitride layer can be an adhesive layer disposed between the copper conductive line and the glass substrate, thereby helpfully increasing the adhesion between the copper conductive line and the glass substrate
Implementation Method 2
the molybdenum nitride layer and the copper metal layer have similar etching property when the molybdenum nitride layer and the copper metal layer are etched
Data Source
AI summary
A TFT array substrate includes a substrate, at least one gate line and gate electrode, a gate insulating layer, and at least one channel component, source electrode, drain electrode and data line. The gate line and gate electrode are disposed on the substrate, wherein both of the gate line and gate electrode have first and second conductive layers, the first conductive layer is formed on the substrate, the first conductive layer contains molybdenum nitride , the second conductive layer is formed on the first conductive layer, and the second conductive layer contains copper. The gate insulating layer is disposed on the gate line, gate electrode and the substrate. The channel component is disposed on the gate insulating layer. The source electrode and drain electrode are disposed on the channel component, and data line is disposed on the gate insulating layer.