Mobile AP Test Sockets with Segmented Thermal Housing
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Solution Overview
Problem
Existing test apparatuses for mobile APs fail to distinguish between defects in the AP package and memory package when stacked, leading to unnecessary discarding of both components due to heat dissipation issues and inability to perform normal tests, and lack effective heat removal mechanisms.
Innovation Solution
A test apparatus with a lower rubber-type socket and an upper metal-based test socket featuring inelastic conductive housing with high thermal conductivity, insulating coating, and conductive parts, allowing separate testing of AP and memory packages before stacking, with improved heat dissipation and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a memory package is mounted on an AP package for testing, then heat dissipation can be performed through the upper mechanism, but it becomes impossible to distinguish whether a defect occurs in the AP package or memory package
Solution Approach 1:
The patent divides the testing system into two independent test sockets: a lower test socket for testing the AP package and an upper test socket for testing the memory package. This segmentation allows each component to be tested separately, enabling precise identification of which component has the defect, while still maintaining heat dissipation capabilities through the upper mechanism during memory package testing.
2Ease of manufacture
If a rubber type test socket is used, then electrical connection can be established, but the socket durability is insufficient
Solution Approach 1:
The upper test socket is constructed using composite materials: an inelastic conductive housing made of metal (such as aluminum or copper) for durability and structural strength, combined with an insulating coating layer and conductive parts made of elastic material. This composite structure provides both the electrical connection capability of rubber sockets and the enhanced durability of metal construction.
3Temperature
If an inelastic conductive housing is used in the upper test socket, then heat dissipation efficiency is improved, but signal interference may increase
Solution Approach 1:
The patent introduces an insulating coating layer as an intermediary between the inelastic conductive housing and the conductive parts. This coating layer (made of materials such as Teflon, DLC, or parylene) electrically isolates the conductive housing from the conductive parts, preventing signal interference, while allowing thermal energy to pass through for efficient heat dissipation from the AP package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise testing of AP package functionality, reduces test processing steps, increases yield, and extends socket durability while minimizing signal interference and heat-related failures.
Implementation Method 1
an inelastic conductive housing provided with a plurality of housing holes penetratingly formed in a thickness direction
Implementation Method 2
an insulating coating layer coated around the plurality of housing holes
Implementation Method 3
a conductive part formed in a form in which a plurality of conductive particles are included in an elastic insulating material
Data Source
AI summary
A test apparatus for testing a mobile AP provided with an AP package and a memory package according to the disclosure is configured to include: a lower test socket mounted on a tester and connected to the AP package put on an upper side thereof; an upper test socket mounted with the memory package and connected to the AP package put on a lower side thereof; an upper mechanism configured to accommodate the memory package and mounted with the upper test socket; and a heat dissipation device disposed on the upper mechanism. Since heat generated in the AP package can be dissipated through forming of a frame of the upper test socket as an inelastic conductive housing of a metal material having high thermal conductivity, a test can be performed in a step before stacking the AP package and the memory package on each other.