Mobile Device Chassis with Composite Frame and Impact Absorber
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Solution Overview
Problem
Existing mobile electronic devices with large user interfaces and thin profiles often fail to withstand tough user environments due to inadequate structural integrity and durability, particularly in terms of impact resistance and component compatibility.
Innovation Solution
A mobile electronic device design featuring an enhanced chassis with a narrow profile, an improved laminate construction, an enhanced tolerance accumulator for battery expansion and contraction, and an antenna farm with minimal Z dimension, which includes a metallic frame, resilient materials, and strategically placed components for enhanced structural reinforcement and impact mitigation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a thin profile is used to reduce device thickness, then the Z dimension is minimized, but structural integrity and impact resistance deteriorate
Solution Approach 1:
The device employs a composite chassis structure combining metal frame members with plastic housing portions. The metal frame provides high strength and stiffness for structural integrity, while the plastic portions allow for thin profile construction. This composite approach enables the device to maintain both thinness and structural strength simultaneously.
Solution Approach 2:
The chassis is segmented into multiple components including front housing, rear housing, and intermediate housing portions connected by metal frame members. This segmentation allows each component to be optimized independently - thin plastic sections for minimal Z dimension and reinforced metal sections for structural support and impact resistance.
2Length of moving object
If a thin profile is used to reduce device thickness, then the Z dimension is minimized, but durability in tough user environments deteriorates
Solution Approach 1:
The device incorporates pre-configured impact mitigation features including resilient materials and cushioning structures within the multi-component housing. These elements are designed beforehand to absorb and distribute impact forces, protecting internal components during drops or collisions in tough user environments while maintaining the thin overall profile.
3Strength
If structural reinforcement is added to improve impact resistance, then strength is improved, but device complexity increases
Solution Approach 1:
The design merges the structural reinforcement function with the existing housing components. The metal frame members are integrated into the plastic housing structure, serving both as structural support elements and as part of the overall chassis assembly. This merging approach provides enhanced impact resistance without adding separate, complex reinforcement systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides a robust, durable, and lightweight mobile electronic device that maintains a thin profile while effectively absorbing impacts and ensuring reliable wireless communication, with enhanced structural integrity and RF transparency.
Implementation Method 1
an impact absorber 210, located on an outer most portion of the rear housing 86. The impact absorber 210 can provide enhanced impact mitigation
Implementation Method 2
resilient materials, and strategically placed components for enhanced structural reinforcement and impact mitigation
Data Source
AI summary
A mobile electronic device 10 with an enhanced chassis is disclosed. The device 10 can include: a frame 12 including an upper portion 14 and a lower portion 16 defining a narrow profile height 18 having an open top 20 and an open bottom 22; the frame 12 includes an interior portion 24 configured to surround components in a predetermined arrangement and an exterior portion 26; the exterior portion 26 of the frame 12 being connected to a printed circuit board (PCB) 28; and the open top 20 being configured to receive components on the printed circuit board 28 and the open bottom 22 being configured to receive a battery 32. Advantageously, the frame 12 height 13 provides a narrow profile structural system to securely support and connect components in connection with mobile electronic devices. Beneficially, the height is structurally passive and free from contributing to the Z dimension.