Mobile Device Frame Between Circuit Boards
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Solution Overview
Problem
Mobile electronic devices face a challenge in increasing available space for electrical elements while maintaining compact dimensions, as their functions progress, leading to conflicts with their portability and miniaturization trends.
Innovation Solution
A mobile electronic device design incorporating a frame between two circuit boards that increases space for receiving circuit boards and electrical elements, with the frame directly engaging with the housing to simplify assembly and reduce tolerances, and includes a shutter to prevent light interference from LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the functions of mobile electronic devices are increased, then the available space for electrical elements must be increased, but the device dimensions increase, conflicting with portability and miniaturization trends
Solution Approach 1:
The circuit boards are nested between the first and second housings with the frame structure providing intermediate support. The frame is disposed between the circuit boards, creating a compact nested arrangement that maximizes space utilization within the device housing, allowing more electrical elements to be accommodated without increasing overall device volume
Solution Approach 2:
The frame structure introduces an additional dimensional layer between the circuit boards, creating vertical spacing that allows for better organization and accommodation of electrical elements. This dimensional approach enables efficient use of three-dimensional space within the constrained device volume
2Adaptability or versatility
If multiple components are assembled separately, then flexibility in design is improved, but assembly tolerances accumulate and assembly processes become complex
Solution Approach 1:
The frame is integrated with the first housing to form a unified structure, eliminating the need for separate assembly of the frame with the housing. This merging approach reduces the number of interfaces and cumulative tolerances, while still maintaining design flexibility through the modular circuit board assembly that can be independently configured between the housing and second housing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes device size, enhances space for electrical components, simplifies assembly, reduces noise, and improves haptic feedback, while maintaining compact dimensions and functionality.
Implementation Method 1
a first circuit board with a plurality of light emitting diodes
Data Source
AI summary
A mobile electronic device is provided, including a first housing, a second housing and a circuit board assembly. The first housing is connected to the second housing to form a receiving space with the circuit board assembly disposed therein. The circuit board assembly includes a first circuit board having a plurality of light emitting diodes, a second circuit board, and a frame disposed between the first circuit board and the second circuit board.