Mobile Device Thermal Access Cover for Heat Dissipation

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Solution Overview

Problem

Mobile devices face thermal limitations that restrict their performance and longevity due to heat generated by central processing IC components, leading to overheating and reduced user comfort, with existing cooling methods inadequate for sustained high-performance operation.

Innovation Solution

A mobile device design featuring a user-operable thermally-conductive panel that can be exposed for enhanced cooling, combined with a dock that includes thermal transfer devices such as convective heat sinks or fans to facilitate active and passive cooling, allowing for higher power operation without overheating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat spreader is used to distribute heat from the central processing IC component, then the temperature normalization is improved, but the device still cannot sustain high-performance operation for extended periods due to thermal limitations

Engineering Contradiction:

Improvetemperature normalizationVSAvoidduration of high-performance operation

Core Design Contradiction:

TemperatureVSDuration of action of moving object

Solution Approach 1:

The cooling system is segmented into multiple functional components: a heat spreader for initial heat distribution, a thermally-conductive panel for enhanced heat transfer, and a dock with thermal transfer devices for final heat dissipation. This segmentation allows each component to specialize in a specific stage of the cooling process, enabling sustained high-performance operation by efficiently managing heat at each stage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thermally-conductive panel acts as an intermediary between the heat spreader and the dock's thermal transfer devices. This intermediate component enhances heat transfer efficiency by providing a dedicated thermal pathway, bridging the gap between the IC component and the external cooling system, thereby enabling extended high-performance operation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the mobile device operates at higher power levels, then computational performance is improved, but heat generation increases causing overheating and reduced user comfort

Engineering Contradiction:

Improvecomputational performanceVSAvoidheat generation

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The system converts the harmful heat generated by high-power computational operations into a manageable thermal flow by directing it through the heat spreader, thermally-conductive panel, and dock's thermal transfer devices. This transformation allows the device to sustain higher power levels for PC-level computational performance while the structured thermal pathway prevents overheating and maintains user comfort.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Object-affected harmful factors

If a cover is used to protect the mobile device from environmental contaminants, then protection is improved, but thermal dissipation is reduced

Engineering Contradiction:

Improveprotection from environmental contaminantsVSAvoidthermal dissipation

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The cover is designed with dynamic thermal management capabilities, incorporating a thermally-conductive panel that can be exposed or covered based on thermal conditions. This dynamic design allows the cover to switch between protection mode (covering the panel) and cooling mode (exposing the panel), thereby maintaining both protection from environmental contaminants and effective thermal dissipation as needed.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The cover serves multiple functions: it provides protection from environmental contaminants while also incorporating a thermally-conductive panel that enhances heat dissipation when exposed. This multi-functional design allows the same component to fulfill both protective and thermal management roles, resolving the contradiction between protection and thermal dissipation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables mobile devices to maintain higher performance levels for extended periods while preventing overheating, supporting personal computer-level computational performance when docked and providing improved durability and protection against environmental contaminants.

Implementation Method 1

a thermally-conductive panel in thermal communication with the circuitry

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a dock that includes thermal transfer devices such as convective heat sinks or fans

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10404309B2Mobile device with user-operable cover for exposing thermally conductive panel

Publication Date: 2019.09.03 INTEL CORP

AI summary

A mobile device may include circuitry, a thermally-conductive panel in thermal communication with the circuitry, and a housing with a user-operable thermal access cover that has a closed position to cover the thermally-conductive panel and an open position to expose the thermally-conductive panel. Embodiments may include a dock with which the mobile device may be engaged, wherein the dock may include a thermal transfer device to engage the thermally-conductive panel of the mobile device.