Mobile Device Surface Temperature Management via Dynamic Frequency Scaling
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Solution Overview
Problem
Mobile devices face challenges in effectively managing surface temperatures and memory thermal management, leading to potential overheating and performance issues, especially in multichip packages where heat transfer between components can be inefficient.
Innovation Solution
A surface temperature management method that involves sensing the temperature of application processors and using a surface temperature management table to control the device's operation, adjusting frequencies and frame rates to maintain optimal temperatures, and a memory thermal management method that distinguishes between memory temperatures to control the application processor's performance accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the application processor operates at high frequency to improve performance, then productivity is improved, but temperature increases leading to overheating
Solution Approach 1:
The patent implements dynamic frequency adjustment of the application processor based on real-time temperature sensing. The processor frequency is automatically increased when temperature is within acceptable ranges to maximize performance, and decreased when temperature thresholds are exceeded to prevent overheating. This dynamic adaptation resolves the contradiction between maintaining high productivity and controlling temperature.
Solution Approach 2:
The system changes operational parameters (frequency, frame rate) based on temperature conditions. By monitoring temperature and adjusting the processor frequency and display frame rate accordingly, the system optimizes the balance between performance output and thermal generation, allowing high performance when cool and reducing load when hot.
2Productivity
If the application processor operates at high frequency to improve performance, then power consumption increases
Solution Approach 1:
The patent employs dynamic frequency scaling that adjusts the processor operating frequency based on thermal conditions and performance requirements. When temperature is low, the processor runs at higher frequencies for maximum performance. When temperature rises, the frequency is reduced to decrease power consumption while maintaining acceptable performance levels, thus resolving the contradiction between productivity and energy use.
Solution Approach 2:
The system dynamically changes the operational parameters including frequency and frame rate based on temperature feedback. This parameter adjustment optimizes the trade-off between performance output and power consumption by running at high performance only when thermal conditions permit, and reducing power consumption when thermal limits are approached.
3Productivity
If memory operates at high speed to improve performance, then productivity is improved, but heat generation increases affecting nearby components
Solution Approach 1:
The patent implements separate temperature monitoring and control for different components including memory and processor. The system senses memory temperature specifically and can adjust memory operating parameters independently based on local thermal conditions, allowing optimized performance for each component based on its specific thermal environment rather than uniform system-wide control.
Solution Approach 2:
The system adjusts memory operating parameters including speed and refresh rates based on sensed memory temperature. When memory temperature is within acceptable ranges, higher speeds are maintained for maximum performance. When temperature exceeds thresholds, the system reduces memory speed to decrease heat generation, resolving the contradiction between memory performance and thermal management.
4Temperature
If cooling measures are intensified to reduce temperature, then temperature is controlled, but device complexity increases
Solution Approach 1:
The patent implements a self-regulating thermal management system where the processor and memory automatically adjust their operating parameters based on real-time temperature sensing. The system monitors its own thermal state and autonomously adjusts frequency and speed without requiring external thermal management hardware or complex control systems, thus maintaining temperature control while minimizing added complexity.
Solution Approach 2:
The system employs temperature feedback mechanisms where sensors continuously monitor thermal conditions and feed this information back to the control logic. Based on this feedback, the system automatically adjusts operational parameters to maintain temperature within acceptable ranges. This feedback-based approach provides effective thermal control through software-based adaptation rather than complex hardware cooling systems.
Data Source
AI summary
A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.