Mobile Terminal Thermal Management via Flexible Interlayer
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Solution Overview
Problem
As mobile terminals become more functional, they generate significant heat from drive chips, leading to performance deterioration and the need for effective heat dissipation while also requiring protection from shocks.
Innovation Solution
A mobile terminal design incorporating a thermal conductivity sheet with a flexible material to efficiently transfer heat from the drive chip to a metallic frame, using a conductive tape with adhesive properties and a flexible material to absorb shocks, preventing heat damage and shock transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid thermal conductivity sheet is used to transfer heat from the drive chip, then heat dissipation efficiency is improved, but shock protection capability deteriorates
Solution Approach 1:
The patent employs a composite structure consisting of a thermal conductivity sheet combined with a flexible material. The thermal conductivity sheet (made of materials like aluminum or copper) provides efficient heat transfer pathways, while the flexible material (such as silicone rubber or foam) provides shock absorption. This composite approach allows the system to simultaneously achieve both effective heat dissipation and shock protection, resolving the contradiction between rigid heat conduction and flexible shock absorption.
Solution Approach 2:
The flexible material acts as an intermediary element between the drive chip and the thermal conductivity sheet. It mediates between the conflicting requirements of rigid heat conduction and flexible shock absorption by providing a compliant interface that transmits thermal energy while absorbing mechanical shocks. This intermediary layer enables the system to achieve both heat dissipation efficiency and shock protection capability.
2Device complexity
If the drive chip is directly mounted to the frame, then structural simplicity is improved, but heat dissipation and shock protection deteriorate
Solution Approach 1:
The patent segments the mounting structure into distinct functional layers: the drive chip, the flexible material layer, the thermal conductivity sheet, and the frame. This segmentation allows each layer to perform its specific function optimally - the flexible material for shock absorption and the thermal conductivity sheet for heat dissipation - while collectively providing both protection and thermal management that direct mounting cannot achieve.
3Reliability
If a thick flexible material is used to absorb shocks, then shock protection is improved, but thermal conductivity and radiation efficiency deteriorate
Solution Approach 1:
The patent applies local quality by making the flexible material layer relatively thin only in the region directly beneath the drive chip where thermal conduction is critical, while maintaining sufficient thickness in other areas to provide shock absorption. This localized variation in thickness allows the system to achieve both shock protection and adequate thermal conductivity, resolving the contradiction between thick flexible material for shock absorption and thin material for heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from the drive chip, preventing damage to other components and absorbing shocks without transferring them to the drive chip, thus enhancing the terminal's performance and durability.
Implementation Method 1
a thermal conductivity sheet comprising one surface in contact with a top surface of the drive chip and the other surface in contact with an inner surface of the frame
Implementation Method 2
a flexible material insertedly filling in a space formed between the thermal conductivity sheet and the frame
Data Source
AI summary
There is disclosed a mobile terminal including a case comprising an electric control unit in which electronic components are loaded; a display unit coupled to a front surface of the case; a frame coupled to the case and supporting a rear surface of the display unit, the frame comprising a metallic material; a mainboard loaded in the case; a drive chip loaded in the mainboard; a shield can covering components loaded in the mainboard, the shied comprising a hole formed, corresponding to the drive chip; a thermal conductivity sheet comprising one surface in contact with a top surface of the drive chip and the other surface in contact with an inner surface of the frame; and a flexible material insertedly filling in a space formed between the thermal conductivity sheet and the frame, so that the heat generated in the drive chip of the mobile terminal may be effectively emitted and that only the portion of the mobile terminal, where the drive chip is loaded, may be prevented from being heated when the user is using the mobile terminal and the other components may be prevented from being damaged by the heat.