MOCVD Gas Sequencing for Abrupt GaN-AlGaN Hetero Interfaces

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Solution Overview

Problem

Existing methods using MOCVD struggle to achieve an ideally abrupt hetero interface in nitride semiconductor HEMT devices, hindering the production of high-performance devices with high mobility and conductance.

Innovation Solution

A method involving specific gas supply sequences in MOCVD, including growth interrupt and pre-flow processes, to form an abrupt interface between GaN and AlGaN layers, ensuring precise control of gas flow rates and durations to enhance interface abruptness without requiring a wide band gap spacer layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a spacer layer is inserted between electron transit layer and barrier layer to improve interface abruptness, then mobility and conductance are improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveinterface abruptnessVSAvoiddevice complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the spacer layer from the device structure, achieving interface abruptness through optimized gas supply sequences in MOCVD that directly form the hetero interface between electron transit layer and barrier layer without requiring an intermediate spacer layer

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the manufacturing parameters by optimizing gas supply sequences, growth interrupt timing, and pre-flow conditions to achieve abrupt hetero interfaces through controlled deposition processes rather than through structural modifications with spacer layers

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If conventional MOCVD method is used to form hetero interface, then manufacturing process is simple, but interface abruptness is insufficient

Engineering Contradiction:
Improveease of manufactureVSAvoidinterface abruptness
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention implements periodic growth interrupt and pre-flow sequences during MOCVD processing, where gas supply is periodically interrupted and pre-flow conditions are applied between layer formations to achieve abrupt compositional transitions at the hetero interface

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The invention applies preliminary pre-flow of aluminum source gas before barrier layer formation to prepare the interface region, ensuring abrupt compositional change without requiring complex post-processing or spacer layers

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the abruptness of the hetero interface, enhancing mobility and conductance in the two-dimensional electron gas layer while reducing leakage current and contact resistance, thereby producing high-performance HEMT devices without increasing electrode resistance.

Implementation Method 1

a second semiconductor layer of AlxGa1-x-yInyN on a first semiconductor layer of GaN by hetero-epitaxial growth using a MOCVD method

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 2

a two-dimensional electron gas layer that is to be an electrically conductive layer is formed in parallel with the hetero interface by a piezoelectric effect

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS8524550B2Method of manufacturing semiconductor device and semiconductor device
Publication Date: 2013.09.03 SANKEN ELECTRIC CO LTD
  • US8524550B2 patent drawing
  • US8524550B2 patent drawing
  • US8524550B2 patent drawing

AI summary

A method of manufacturing a semiconductor device, in which a second semiconductor layer of AlxGa1-x-yInyN (wherein x, y, and x+y satisfy x>0, y≧0, and x+y≦1, respectively) on a first semiconductor layer of GaN by hetero-epitaxial growth using a MOCVD method, the method including the steps of: (a) supplying N source gas and Ga source gas to form the first semiconductor layer; (b) supplying the N source gas without supplying the Ga source gas and Al source gas, after step (a); (c) supplying the N source gas and the Al source gas without supplying the Ga source gas, after step (b); and (d) supplying the N source gas, the Ga source gas and the Al source gas to form the second semiconductor layer, after step (c).