Modifiable Substrate Package Structure for IC Thermal and Electrical Optimization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional lead frame-based IC package structures are costly, limited in design flexibility, lack modular capability, and have poor heat dissipation and electrical performance, with no easy method for modifying or repairing conductive patterns.
Innovation Solution
A package structure combining a device carrier with a modifiable substrate and conductive elements, where the substrate's conductive pattern is directly connected to the device carrier, allowing for reduced module size, improved electrical efficiency, and the ability to modify or replace the substrate for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional lead frame-based IC package structure is used, then manufacturing process is mature and easy to implement, but cost is higher and design flexibility is limited
Solution Approach 1:
The package structure is divided into separate functional modules: lead frame for electrical connection, substrate for conductive pattern, and recess for device mounting. This segmentation allows independent optimization of each module while maintaining overall manufacturability through standardized assembly processes.
Solution Approach 2:
The substrate serves multiple functions: providing conductive patterns for electrical connection, offering mechanical support, and enabling design flexibility through replaceability. The lead frame simultaneously provides electrical connection and structural support, making the overall structure adaptable to different device configurations.
2Ease of manufacture
If conventional lead frame-based IC package structure is used, then manufacturing process is simple, but module size cannot be reduced
Solution Approach 1:
Conductive elements are positioned in three-dimensional space with portions located in the recess below the substrate plane. This vertical arrangement reduces the horizontal footprint and overall package volume while maintaining electrical connection paths through the substrate's conductive patterns.
Solution Approach 2:
Conductive elements are embedded within the recess of the device carrier, nesting components vertically rather than arranging them in a single plane. This nested configuration reduces the overall package volume while maintaining all necessary electrical connections.
3Ease of manufacture
If conventional lead frame-based IC package structure is used, then single device packaging is straightforward, but modular capability is lacking
Solution Approach 1:
The package structure is segmented into replaceable modules: the substrate with conductive patterns can be independently replaced or modified without affecting the lead frame or recess structure. This modular design enables flexible configuration for different device packaging needs while maintaining standardized manufacturing processes.
Solution Approach 2:
The substrate is designed to be replaceable and modifiable, transforming the static package structure into a dynamic system that can be reconfigured for different applications. This allows the same lead frame and recess structure to accommodate different substrates with varying conductive patterns for different device configurations.
4Ease of manufacture
If conventional lead frame-based IC package structure is used, then manufacturing process is established, but heat dissipation performance is poor
Solution Approach 1:
The substrate acts as an intermediary thermal management component between the conductive elements in the recess and the lead frame. The conductive patterns on the substrate provide thermal pathways that facilitate heat dissipation from active devices while maintaining electrical connection, bridging the thermal gap in the manufacturing-established structure.
5Reliability
If conductive pattern needs to be modified in conventional package structure, then local repair is impossible, but complete replacement is costly
Solution Approach 1:
The conductive pattern is segmented into the substrate, which can be independently replaced. If the conductive pattern fails or needs modification, only the substrate requires replacement rather than the entire package, enabling cost-effective repair and modification while maintaining reliable electrical connections through the standardized substrate interface.
Solution Approach 2:
The substrate with conductive patterns can be discarded and replaced with a new substrate when modification or repair is needed. This approach recovers the valuable lead frame and recess structure while replacing only the consumable substrate component, making the system economically repairable and modifiable.
Data Source
AI summary
The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.