Modified Bismaleimide Prepolymer for Low Dielectric Loss

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Solution Overview

Problem

Conventional bismaleimide resins used in electronic board substrates face challenges with high water absorption, high dielectric constant, and high dielectric loss, making them unsuitable for high-end integrated circuits, despite efforts to improve heat resistance and mechanical properties.

Innovation Solution

A modified allyl compound with a cyclopentadiene structure and a benzene ring or a benzene ring substituted with a linear alkane of lower polarity is used to modify bismaleimide prepolymers, reducing water absorption, dielectric constant, and dielectric loss while enhancing heat resistance by improving solubility and reducing crosslinking density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional modifiers such as 2,2'-diallyl bisphenol A (DABPA) are used to prepare modified bismaleimide prepolymers, then the solubility and compatibility of bismaleimide prepolymers are improved, but the dielectric constant and dielectric loss of the cured product increase, resulting in poor heat resistance and high water absorption

Engineering Contradiction:

Improvesolubility and compatibilityVSAvoiddielectric constant, dielectric loss, heat resistance, water absorption

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent changes the chemical structure parameters of the allyl compound modifier by introducing a cyclopentadiene ring structure and specific benzene ring substitutions. This structural parameter change fundamentally alters the properties of the modified bismaleimide prepolymer, achieving both improved solubility and reduced dielectric constant and dielectric loss compared to conventional modifiers like DABPA

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite molecular structure by combining the bismaleimide resin with a specifically designed allyl compound containing cyclopentadiene and benzene ring structures. This composite approach allows the synergistic combination of solubility enhancement from the allyl groups and improved dielectric properties from the cyclopentadiene-benzene structure

Inventive Principle:

Principle #40Composite materials

2Temperature

If bismaleimide resin is used to prepare electrical board substrates, then heat resistance and mechanical properties are improved, but water absorption, dielectric constant, and dielectric loss value increase

Engineering Contradiction:

Improveheat resistanceVSAvoidwater absorption, dielectric constant, dielectric loss

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent modifies the bismaleimide resin by changing its chemical structure parameters through reaction with a specifically designed allyl compound. The introduction of cyclopentadiene and benzene ring structures with linear alkane substitutions changes the physical and chemical parameters of the cured resin, achieving low water absorption and low dielectric properties while maintaining heat resistance

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces specific local structural features (cyclopentadiene rings, benzene rings with linear alkane substitutions) at strategic positions in the polymer chain. These local structural modifications create regions with low polarity and reduced crosslinking density, which locally reduce water absorption and dielectric loss while the overall network maintains heat resistance

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modified bismaleimide prepolymer achieves improved heat resistance, low water absorption, and reduced dielectric constants, making it suitable for high-end integrated circuits with enhanced performance.

Implementation Method 1

modified allyl compound... to modify bismaleimide prepolymers... resulting in improved solubility of bismaleimide, thereby reducing the water absorption, dielectric constant and dielectric loss value of the resin, while improving the heat resistance

Methodology Applied

Scientific EffectChemical Bonding: Chemical Bonding

Data Source

PatentUS12139582B2Modified allyl compound, modified bismaleimide prepolymer

Publication Date: 2024.11.12 GUANGDONG HINNO TECH CO LTD

AI summary

The present disclosure provides a modified allyl compound, and a modified bismaleimide prepolymer. The modified allyl compound is represented by formula (1), has a cyclopentadiene structure represented by formula (2), and contains a benzene ring or a benzene ring substituted with a linear alkane of lower polarity.