Modified Dematching Layer for Ultrasonic Transducer Footprint Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional transducers with quarter-wavelength vibration mode have a larger footprint due to the need for multiple layers, which complicates manufacturing and increases costs, while those with half-wavelength vibration mode have lower sensitivity and bandwidth.
Innovation Solution
A modified dematching layer formed from a metamaterial with a higher acoustic impedance matrix and lower impedance inclusions, which acts as both a dematching and backing layer, attenuates acoustic energy and reduces the transducer's thickness, allowing for a smaller footprint and enhanced sensitivity and bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional dematching layer with separate backing layer is used in quarter-wavelength vibration mode transducers, then the transducer achieves effective damping and resonance frequency matching, but the footprint and thickness increase
Solution Approach 1:
The patent combines the dematching layer and backing layer into a single integrated structure. The dematching layer is configured to perform both dematching functions (impedance transformation) and backing functions (acoustic damping), eliminating the need for a separate backing layer and reducing the overall transducer footprint while maintaining effective damping.
Solution Approach 2:
The dematching layer is designed to serve multiple functions simultaneously: it acts as an impedance transformer between the piezoelectric element and the load, while also providing acoustic damping and backing support. This multi-functionality reduces the number of separate components needed and decreases the transducer's overall thickness.
2Reliability
If multiple layers (piezoelectric material, backing layer, dematching layer) are used, then the transducer achieves proper acoustic impedance matching and damping, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the backing layer and dematching layer into a single integrated dematching structure, reducing the number of discrete layers from three (piezoelectric element, backing layer, dematching layer) to two (piezoelectric element, integrated dematching layer). This simplification reduces manufacturing complexity while preserving acoustic impedance matching through the configured impedance gradient in the integrated layer.
3Reliability
If quarter-wavelength vibration mode piezoelectric material is used, then the transducer achieves enhanced sensitivity and bandwidth, but the footprint increases due to the acoustic stack thickness
Solution Approach 1:
The integrated dematching layer performs multiple functions including impedance transformation, acoustic damping, and structural support, allowing the quarter-wavelength piezoelectric material to achieve enhanced sensitivity and bandwidth without requiring additional separate layers that would increase footprint. The multi-functional design optimizes space utilization.
Solution Approach 2:
The patent configures the integrated dematching layer with specific impedance parameters and thickness to optimize the acoustic impedance gradient, enabling the quarter-wavelength piezoelectric material to achieve target resonant frequency and enhanced sensitivity while minimizing the overall acoustic stack thickness and footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified dematching layer reduces the transducer's footprint, increases sensitivity and bandwidth, and simplifies manufacturing by eliminating the need for a separate backing layer, enabling its use in various applications with improved performance.
Implementation Method 1
the inclusions having a second acoustic impedance lower than the first acoustic impedance and configured to attenuate acoustic energy at an acoustic band gap of the modified dematching layer
Implementation Method 2
the inclusions configured to attenuate acoustic energy at an acoustic band gap of the modified dematching layer
Implementation Method 3
a transducer may include a piezoelectric material which generates electrical voltage from a mechanical stress or strain exerted on the material and converts electrical signals into mechanical vibrations
Implementation Method 4
a piezoelectric material which generates electrical voltage from a mechanical stress or strain exerted on the material
Implementation Method 5
The backing layer may be formed of a material with an acoustic impedance similar to that of the piezoelectric materials to provide effective damping in the transducer
Data Source
AI summary
Various methods and systems are provided for a modified dematching layer for a transducer. In one example, the dematching layer includes a matrix having a first acoustic impedance and inclusions embedded in the matrix. The inclusions may have a second acoustic impedance that is lower than the first acoustic impedance and may be configured to attenuate acoustic energy at an acoustic band gap of the modified dematching layer.