Modified Metal Nanoplate Conductive Paste Low-Temperature Processing
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Solution Overview
Problem
Current conductive pastes for applications like flexible printed circuit boards and RFID require high conductivity, but metal nanoparticles used often have poor inherent conductivity and require high temperature thermal treatments, which can damage plastic substrates and limit film forming ability.
Innovation Solution
A modified metal nanoplate with a specific size range and surface agents, including an oxygen-containing polymer and C6-C12 alkylamine, allowing for flexible and conductive thin film formation without high temperature sintering, using a conductive paste with these nanoplates dispersed in a solvent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal nanoparticles are used as the main raw material of conductive paste, then the inherent conductivity is improved, but high temperature thermal treatments are required which damage plastic substrates
Solution Approach 1:
The patent uses a polymer material as an intermediary binder to bond metal nanoparticles together, forming conductive paths without requiring high temperature sintering. The polymer matrix holds the nanoparticles in close proximity, enabling electrical conductivity through the nanoparticle network rather than through sintered metal-to-metal contact, thus avoiding temperatures that would damage plastic substrates.
Solution Approach 2:
The patent changes the processing temperature parameter from high temperature (required for traditional sintering) to low temperature (suitable for plastic substrates). By using a polymer-based conductive paste formulation, the curing temperature is reduced to below the glass transition temperature of the plastic substrate, preventing substrate deformation while still achieving adequate conductivity through the polymer-bonded nanoparticle structure.
2Shape
If metal nanoparticles with small size are used, then film forming ability is improved, but conductivity decreases due to quantum effect
Solution Approach 1:
The patent employs different metal nanoparticle sizes in different regions or combinations within the conductive paste formulation. By mixing nanoparticles of various sizes (e.g., combining smaller nanoparticles for good film forming with larger nanoparticles for better conductivity), the local properties are optimized - smaller particles fill gaps and improve coverage while larger particles provide conductive pathways, achieving both good film forming ability and adequate conductivity.
3Stability of the object's composition
If polymer materials are used as protecting agents for metal nanomaterials, then dispersion is improved, but conductivity is reduced due to low conductivity of polymers
Solution Approach 1:
The patent extracts or removes the polymer protecting agents from the surface of the metal nanoparticles before forming the conductive paste. By eliminating the insulating polymer layer that would otherwise block electrical contact between particles, the metal nanoparticle surfaces are exposed to directly contact with each other and with the conductive matrix, maintaining good dispersion while restoring electrical conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified metal nanoplate-based conductive paste achieves excellent conductivity and flexibility at lower temperatures, avoiding the need for high temperature sintering and protecting plastic substrates, while maintaining stable conductivity and film forming ability.
Implementation Method 1
The first protecting agent is disposed on a surface of the metal nanoplate, and the first protecting agent includes an oxygen-containing polymer. The second protecting agent is disposed on the surface of the metal nanoplate, and the second protecting agent includes a C6-C12 alkylamine.
Data Source
AI summary
A modified metal nanoplate and a conductive paste including the same are provided. The modified metal nanoplate includes a metal nanoplate, a first protecting agent, and a second protecting agent. The metal nanoplate has an average width of 0.3-20 μm and an average thickness of 10-35 nm. The first protecting agent is disposed on a surface of the metal nanoplate and includes an oxygen-containing polymer. The second protecting agent is disposed on the surface of the metal nanoplate and includes a C6-C12 alkylamine.