Modified Phenolic Resins with Silicic Acid Ester Units

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Solution Overview

Problem

Conventional phenolic resins in foundry binder systems face issues with odor nuisance, pollutant emissions, condensate formation, and thermal stability, particularly in cold box, polyurethane nobake, and shell molding processes.

Innovation Solution

Modified phenolic resins containing silicic acid ester groups are used, where free hydroxy groups of phenolic resins are reacted with esters of orthosilicic acid, disilicic acid, or polysilicic acid to form thermally stable units, reducing the aforementioned issues by enhancing thermal resistance and minimizing gas development.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional phenolic resins are used in foundry binder systems, then the binder system provides basic binding functionality, but odor nuisance and pollutant emissions increase

Engineering Contradiction:
Improveodor nuisance and pollutant emissionsVSAvoidbinding functionality
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent modifies the chemical structure of phenolic resins by introducing silicic acid ester groups through reaction with esters of orthosilicic acid, disilicic acid, or polysilicic acid. This parameter change in molecular composition reduces odor nuisance and pollutant emissions while preserving binding functionality through the maintained phenolic resin backbone structure.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite material by combining phenolic resin units with silicic acid ester groups to form modified phenolic resins. This composite structure integrates the binding properties of phenolic resins with the thermal stability and reduced emissions characteristics of silicic acid esters, simultaneously achieving both improved environmental performance and reliable binding functionality.

Inventive Principle:
Principle #40Composite materials

2Temperature

If conventional phenolic resins are used, then the binder system is simple to manufacture, but thermal resistance is insufficient

Engineering Contradiction:
Improvethermal resistanceVSAvoidmanufacturing complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent introduces silicic acid ester groups into the phenolic resin structure through controlled chemical reaction with esters of orthosilicic acid, disilicic acid, or polysilicic acid. This parameter change in molecular composition significantly enhances thermal resistance while the reaction process uses conventional chemical synthesis methods that maintain ease of manufacture.

Inventive Principle:
Principle #35Parameter changes

3Object-generated harmful factors

If conventional phenolic resins are used, then the binder system has low complexity, but gas development during foundry processes increases

Engineering Contradiction:
Improvegas developmentVSAvoidbinder system complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The modification of phenolic resins with silicic acid ester groups changes the chemical composition parameter, which reduces gas development during foundry processes. The silicic acid ester structure provides thermal stability that minimizes decomposition and gas evolution, while the overall binder system complexity remains manageable through straightforward chemical modification.

Inventive Principle:
Principle #35Parameter changes

4Strength

If phenolic resins are modified with silicic acid ester groups, then thermal resistance and molding strength improve, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvemolding strengthVSAvoidmanufacturing process complexity
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The chemical modification of phenolic resins with silicic acid ester groups changes the molecular structure parameter, resulting in enhanced molding strength and thermal resistance. The manufacturing process complexity increases only moderately through the addition of the silane modification step, which uses conventional chemical reaction conditions and procedures.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modified phenolic resins significantly reduce odor nuisance, pollutant emissions, and condensate formation while improving thermal resistance and the strength of moldings, making them suitable for use in foundry processes.

Implementation Method 1

free hydroxy groups of phenolic resins are reacted with esters of orthosilicic acid, disilicic acid, or polysilicic acid to form thermally stable units

Methodology Applied
Scientific EffectChemical bonding: Chemical Bonding

Data Source

PatentEP2379611B1Modified phenolic resins
Publication Date: 2017.11.29 HUTTENES-ALBERTUS CHEMISCHE WERKE GMBH
  • EP2379611B1 patent drawingFigure 1
  • EP2379611B1 patent drawingFigure 2
  • EP2379611B1 patent drawingFigure 3

AI summary

The invention relates to modified phenolic resins containing silicic acid ester units. The modified phenolic resins can be used, for example, as components of foundry binder systems. The invention also relates to a method for producing such modified phenolic resins and two-component binder systems containing said modified phenolic resins. The invention further relates to methods for producing foundry moulds and foundry cores containing the modified phenolic resins, and to the foundry moulds and foundry cores per se.