Modified Polyimide Resin for Photolithographic Solvent Solubility
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Solution Overview
Problem
Existing polyimide resins exhibit insufficient solvent solubility, limiting their application in high-density and high-integration semiconductor devices, where improved solubility is required for better pattern developability in photolithography.
Innovation Solution
A polyimide resin is developed using specific tetracarboxylic acid anhydride and diamine compounds, with a modified structure and molecular weight range, enhancing solvent solubility and incorporating a photosensitive resin composition for improved pattern development.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If aromatic polyimide resin is used to achieve heat resistance and mechanical properties, then excellent thermal and mechanical performance is obtained, but solvent solubility deteriorates
Solution Approach 1:
The patent uses composite materials by combining aromatic tetracarboxylic dianhydride (providing heat resistance) with aliphatic diamine (improving solubility). This creates a polyimide resin that maintains thermal stability while achieving sufficient solvent solubility for photolithography processing.
Solution Approach 2:
The patent introduces local quality changes by incorporating specific functional groups (aliphatic diamine segments) into the polyimide structure at controlled ratios. This allows different regions of the polymer chain to have different properties: aromatic segments for thermal stability and aliphatic segments for solubility.
2Reliability
If thermal imidization at high temperature (180-400°C) is performed to form polyimide, then ring closure and dehydration are achieved, but defects occur and workability deteriorates
Solution Approach 1:
The patent changes the imidization parameters by performing the reaction at lower temperatures (80-150°C) compared to conventional high-temperature imidization. This is achieved by using a catalyst and controlling the reaction conditions, thereby reducing defects and improving workability while still achieving complete polyimide formation.
Solution Approach 2:
The patent uses an intermediary approach by first forming polyamic acid at lower temperatures, then converting it to polyimide through controlled imidization. This two-step process with intermediate stabilization allows for better process control and reduced defects compared to direct high-temperature imidization.
3Reliability
If conventional polyimide resin is used for semiconductor applications, then basic insulating properties are achieved, but pattern developability deteriorates due to insufficient solubility difference between exposed and unexposed portions
Solution Approach 1:
The patent changes the chemical composition parameters of the polyimide resin by incorporating aliphatic diamine in specific ratios (10-50 mol%). This modification enhances the solubility difference between exposed and unexposed portions, enabling better pattern developability in photolithography while maintaining insulating properties.
Solution Approach 2:
The patent creates a composite polyimide structure combining aromatic and aliphatic segments, where the aromatic parts maintain insulating properties and the aliphatic parts enhance solubility contrast for photolithography. This composite approach simultaneously achieves both insulating reliability and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified polyimide resin achieves excellent solvent solubility, enabling high-density semiconductor applications with reduced residual film ratios and enhanced developability.
Implementation Method 1
a polyamic acid solution, which is a polyimide precursor, is applied, and subjected to dehydration and ring closure by high temperature heating to form a polyimide
Implementation Method 2
Imidization by dehydration and ring closure involves desorption and evaporation of water
Data Source
AI summary
A modified polyimide resin containing a structure represented by general formula (I) below. A polyimide resin containing: a structural unit A derived from a tetracarboxylic dianhydride; and a structural unit B derived from a diamine compound, wherein the structural unit A contains a structural unit derived from a compound having a specific structure in a proportion of 60 mol % or greater.