Modified Polyorganosiloxane Curing Agent for Optical Sealing
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Solution Overview
Problem
Conventional curable compositions used as sealing resins for optical semiconductor devices face issues with heat and light resistance, leading to cracking and tinting, while existing solutions either lack sufficient heat resistance or result in brittle cured products.
Innovation Solution
A curable composition is developed using a modified polyorganosiloxane compound with reduced SiH groups, produced through a method involving the decomposition of polyorganosiloxanes in the presence of a catalyst, which enhances heat and light resistant transparency and crack resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional epoxy resin composition is used as sealing resin, then the resin provides basic sealing function, but heat and light resistance is insufficient causing brightness deterioration
Solution Approach 1:
The patent changes the chemical composition parameters by using alicyclic epoxy resin with specific structural characteristics (rigid cyclic structure) to improve heat and light resistance while maintaining sealing functionality
Solution Approach 2:
The patent creates a composite curable composition combining alicyclic epoxy resin with specific curing agents and additives to achieve enhanced heat resistant transparency and crack resistance properties
2Illumination intensity
If alicyclic epoxy resin is used to improve light resistance, then light resistance improves, but heat resistant transparency remains insufficient
Solution Approach 1:
The patent adjusts the molecular structure parameters of the epoxy resin by selecting alicyclic structures with specific ring sizes and substitutions to simultaneously improve both light and heat resistance properties
3Temperature
If silicone resin is used to achieve excellent heat and light resistant transparency, then heat and light resistant transparency improves, but resin strength is weak causing easy cracking upon thermal impact
Solution Approach 1:
The patent develops a composite curable composition that integrates alicyclic epoxy resin (providing strength and crack resistance) with silicone resin components (providing heat and light resistant transparency), achieving synergistic effects that resolve the contradiction between transparency and strength
Solution Approach 2:
The patent applies different resin components to different functional requirements: the alicyclic epoxy resin matrix provides mechanical strength and crack resistance, while silicone resin additives provide heat and light resistant transparency in specific regions of the cured product
4Strength
If curable composition with compound having at least two SiH groups per molecule is used to improve crack resistance, then crack resistance improves, but production complexity increases
Solution Approach 1:
The patent optimizes the SiH group content parameter in the cyclic polyorganosiloxane to a specific range that provides sufficient crack resistance while maintaining ease of handling and production
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent heat and light resistant transparency along with improved crack resistance, enabling the production of robust cured products suitable for optical semiconductor devices.
Implementation Method 1
decomposing a polyorganosiloxane by heating the polyorganosiloxane in the presence of a catalyst
Implementation Method 2
decomposing a polyorganosiloxane by heating the polyorganosiloxane
Implementation Method 3
heating the polyorganosiloxane in the presence of a catalyst
Data Source
AI summary
An object of the invention is to provide a curing agent and a curable composition capable of forming a cured product, which is applicable for optical material and which has excellent heat and light transparency and crack resistance, and a cured product obtained by curing the same. Moreover, an object of the invention is to provide a method for producing with use of the components of the curing agent a cyclic polyorganosiloxane having a specific structure, in a selective manner and in high yield. In order to attain the objects, a curable composition including, as essential components, (A) an organic compound including at least two carbon-carbon double bonds that are reactive with a SiH group, (B) a compound having at least two SiH groups per molecule, and (C) a hydrosilylation catalyst, uses a modified polyorganosiloxane compound having at least two SiH groups per molecule as the compound having at least two SiH groups, which modified polyorganosiloxane compound is a reaction product of a specific cyclic polyorganosiloxane.