Modified Polyphenylene Ether Resin for Low Dielectric Wiring Boards
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Solution Overview
Problem
Conventional thermosetting resins used in printed wiring boards, such as phenol, epoxy, and polyimide resins, exhibit poor dielectric properties at high frequencies, which is a limitation in the context of downsizing, lightening, and thinning of electronic components with increased integration and capacity.
Innovation Solution
A resin composition comprising polyphenylene ether modified with an ethylenically unsaturated compound, olefin resin with hydroxyl or carboxyl groups, triallyl isocyanurate or triallyl cyanurate, and organic peroxide, which reduces dielectric constant and loss tangent, enhancing high-frequency characteristics and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermosetting resins (phenol, epoxy, polyimide) are used for printed wiring boards, then balanced various performances are achieved, but dielectric properties in high frequency range deteriorate
Solution Approach 1:
The patent uses a composite resin system combining polyphenylene ether (modified with ethylenically unsaturated compound) as the base resin with olefin resin containing hydroxyl or carboxyl groups. This composite approach allows achieving both good dielectric properties in high frequency range and balanced various performances required for wiring boards
Solution Approach 2:
The patent modifies polyphenylene ether by introducing ethylenically unsaturated compounds to create reactive groups that can crosslink with olefin resin. This chemical modification changes the resin parameters to achieve low dielectric constant and loss tangent while maintaining processability and adhesion properties
2Object-affected harmful factors
If polyphenylene ether is applied to metal-clad laminate to improve dielectric properties, then high frequency characteristics are enhanced, but adhesion to metal foil and dimensional stability may deteriorate
Solution Approach 1:
The patent introduces hydroxyl or carboxyl groups into the olefin resin component, which can form strong chemical bonds with metal foil surfaces. This parameter change in the resin chemistry enhances adhesion strength while maintaining the low dielectric properties of the polyphenylene ether base
Solution Approach 2:
The crosslinking reaction between polyphenylene ether and olefin resin creates a three-dimensional network structure that provides dimensional stability. The composite system maintains the low dielectric constant of polyphenylene ether while adding the adhesion and stability benefits of the crosslinked structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves low dielectric constant and loss tangent, resulting in improved high-frequency characteristics and heat resistance, suitable for advanced electronic components.
Implementation Method 1
an ingredient (D) that is an organic peroxide
Data Source
AI summary
A resin composition of the present disclosure contains an ingredient (A) that is a polyphenylene ether whose hydroxyl group bonded to a terminal of a main chain is modified with an ethylenically unsaturated compound, an ingredient (B) that is an olefin resin containing a hydroxyl group or carboxyl group, an ingredient (C) that is at least one kind selected from among triallyl isocyanurate and triallyl cyanurate, and an ingredient (D) that is an organic peroxide.