Modified Polyphenylene Ether Resin Composition for Fine-Circuit Filling
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Solution Overview
Problem
Existing substrate materials for wiring boards fail to maintain low dielectric properties over time, especially in high-temperature and high-humidity environments, and struggle to fill fine circuit patterns effectively.
Innovation Solution
A resin composition containing a modified polyphenylene ether compound with carbon-carbon unsaturated double bonds and a free radical compound with specific structures, which enhances moldability and maintains low dielectric properties and high heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a curable composition containing a radical polymerizable compound and inorganic filler is used, then dielectric properties and heat resistance are improved, but moldability to fill fine circuit patterns deteriorates
Solution Approach 1:
The invention changes the chemical structure parameters of the polymerizable compound by introducing specific aromatic rings (naphthalene, anthracene, phenanthrene) and controlling the number of unsaturated bonds (1-3 per molecule). This parameter optimization allows the resin to achieve both low dielectric constant and high moldability, resolving the contradiction between dielectric performance and filling capability for fine circuit patterns.
Solution Approach 2:
The invention creates a composite resin system combining polymerizable compounds with specific aromatic structures, inorganic fillers (such as silica), and coupling agents. This composite formulation achieves synergistic effects where the aromatic-containing resin provides low dielectric properties while the inorganic filler enhances heat resistance and dimensional stability, and the coupling agent ensures proper adhesion and flow characteristics for filling fine patterns.
2Loss of energy
If substrate materials are used to maintain low dielectric properties, then signal transmission loss decreases, but stability over time in high-temperature and high-humidity environments deteriorates
Solution Approach 1:
The invention incorporates stabilizing aromatic structures (naphthalene, anthracene, phenanthrene rings) into the resin backbone before curing. These rigid, stable aromatic rings provide inherent resistance to thermal and moisture degradation, pre-establishing stability against environmental aging. This preliminary structural design ensures that the low dielectric properties maintained by the aromatic structures remain stable over time even in harsh high-temperature and high-humidity conditions.
Solution Approach 2:
The invention introduces specific functional groups and aromatic structures at localized positions within the polymer chain to provide targeted stability. The aromatic rings are strategically positioned to maintain dielectric properties while the crosslinking density and filler distribution are optimized in specific regions to enhance resistance to thermal and moisture degradation, creating local zones of enhanced stability throughout the material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition provides a cured product with excellent moldability, low dielectric properties, and high heat resistance, maintaining these properties even after heat and water absorption treatments, suitable for use in high-frequency wiring boards.
Implementation Method 1
a resin composition containing a modified polyphenylene ether compound with carbon-carbon unsaturated double bonds and a free radical compound
Data Source
AI summary
An aspect of the present invention relates to a resin composition, which contains a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and a free radical compound, in which the free radical compound has at least one free radical group selected from the group consisting of structures represented by Formulas (1), (2), (3) and (4) in a molecule.