Modified Polyphenylene Ether Resin for High-Frequency PCBs
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Solution Overview
Problem
Current thermosetting resins used in printed wiring boards, such as phenol, epoxy, and polyimide resins, exhibit insufficient dielectric characteristics in the high-frequency range, and there is a need for materials with improved heat resistance, dimensional stability, and reliability, especially in harsh environments.
Innovation Solution
A resin composition comprising modified polyphenylene ether with a carbon-carbon double bond, a crosslinking agent, a crosslinking aid, and an organic peroxide, which forms a polymer with low dielectric constant and loss tangent, enhancing heat resistance and adhesiveness to metal foils.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting resins such as phenol, epoxy, and polyimide resins are used in printed wiring boards, then various performance aspects are well-balanced, but the dielectric characteristics in the high frequency range are insufficient
Solution Approach 1:
The patent modifies the chemical structure of polyphenylene ether by introducing functional groups (carboxyl, hydroxyl, or amino groups) at terminal positions, changing the physical and chemical parameters of the base resin to achieve both good dielectric characteristics and adequate adhesion to metal foils
Solution Approach 2:
The patent creates a composite material system by combining modified polyphenylene ether with specific crosslinking agents (isocyanate, carbodiimide, or amine groups) to form a crosslinked structure that integrates the advantages of low dielectric constant with improved adhesion and heat resistance
2Reliability
If polyphenylene ether is applied to copper-clad laminate sheet, then dielectric characteristics improve, but reflow resistance and adhesion to metal foils become insufficient
Solution Approach 1:
The patent introduces functional groups (carboxyl, hydroxyl, or amino groups) at the terminal positions of polyphenylene ether chains, changing the chemical parameters to enable both low dielectric constant and adequate adhesion to metal foils through these functional groups
Solution Approach 2:
The patent creates a composite structure by combining modified polyphenylene ether with crosslinking agents that have complementary functional groups, forming a crosslinked network that simultaneously provides dielectric performance and adhesion strength
3Reliability
If polyphenylene ether is applied to copper-clad laminate sheet, then dielectric characteristics improve, but heat resistance becomes insufficient
Solution Approach 1:
The patent creates a crosslinked composite material by combining modified polyphenylene ether with crosslinking agents, forming a three-dimensional network structure that maintains the low dielectric constant of polyphenylene ether while adding the heat resistance characteristic of crosslinked structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition produces prepregs and metal-clad laminate sheets with improved dielectric properties, reflow resistance, insulation reliability, and connection reliability, while maintaining excellent heat resistance and adhesiveness.
Implementation Method 1
a crosslinking agent (B), a crosslinking aid (C), and an organic peroxide (D)... the crosslinking aid (C) is a compound represented by General Formula (I) or General Formula (II)
Implementation Method 2
an organic peroxide (D)... which forms a polymer with low dielectric constant and loss tangent
Data Source
AI summary
A resin composition containing: (A) a modified polyphenylene ether having a main chain modified at a terminal end with a functional group having a carbon-carbon double bond; (B) a crosslinking agent; (C) a crosslinking aid; and (D) an organic peroxide. The crosslinking aid (C) is a compound having a specific structure.