Modified Resin Composition for PCB Bonding and Delamination Control
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Solution Overview
Problem
Hydrocarbon resin-based materials used in copper-clad laminates exhibit poor peeling strength, solder ball shear, and high solder floating delamination rates, along with gaps between glass fabric and resin compositions, which hinder high-frequency and high-speed signal transmission in electronic products.
Innovation Solution
A resin composition comprising 100 parts by weight of unsaturated carbon-carbon double bond-containing polyphenylene ether resin, 1 to 20 parts by weight of unhydrogenated maleic anhydride-modified polyolefin, and 5 to 100 parts by weight of benzocyclobutene-modified polyolefin, which improves bonding stability and reduces delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hydrocarbon resin (polybutadiene or butadiene-styrene copolymer) is used as dielectric material, then excellent dielectric properties are achieved, but peeling strength stability deteriorates and solder floating delamination rate increases
Solution Approach 1:
The patent uses a composite resin composition comprising polyphenylene ether resin as the base matrix, combined with polyolefin modified by maleic anhydride and benzocyclobutene. This composite structure integrates the excellent dielectric properties of polyphenylene ether with the bonding enhancement effects of modified polyolefin, simultaneously improving both dielectric performance and peeling strength stability while reducing solder floating delamination.
2Reliability
If hydrocarbon resin is used, then dielectric properties are improved, but bonding gap between glass fabric and resin composition increases
Solution Approach 1:
The patent modifies the chemical structure and surface properties of the resin composition by incorporating maleic anhydride and benzocyclobutene functional groups. These modifications change the resin's chemical parameters to enhance its affinity and bonding capability with glass fabric, thereby reducing bonding gaps and improving manufacturing precision while maintaining dielectric properties.
3Reliability
If hydrocarbon resin is used, then dielectric properties are achieved, but solder ball shear strength deteriorates
Solution Approach 1:
The modified polyolefin component acts as an intermediary between the polyphenylene ether resin matrix and the solder joint. The maleic anhydride and benzocyclobutene modifications create functional groups that enhance interfacial bonding and stress distribution, thereby improving solder ball shear strength while preserving the dielectric properties provided by the polyphenylene ether base resin.
Data Source
AI summary
The present disclosure provides a resin composition comprising: a component (A): 100 parts by weight of polyphenylene ether resin containing unsaturated carbon-carbon double bonds; a component (B): 1 to 20 parts by weight of unhydrogenated maleic anhydride-modified first polyolefin; and a component (C): 5 to 100 parts by weight of benzocyclobutene-modified second polyolefin. Besides, the present disclosure also provides an article made from the resin composition. The article comprises a prepreg, a resin film, a laminate or a printed circuit board that has improvements in one or more properties including stability of peeling strength of bonding sheet and core, solder ball shear, bonding gap and solder floating delamination rate.