Modular 3D Printed Electronics Substrate Design
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Solution Overview
Problem
Current methods for integrating 3D printed structures with electronics are complex and costly, limiting the potential impact of 3D printing technology in key areas such as electronics manufacturing.
Innovation Solution
A computer-implemented system comprising a digital processing device with a 3D modeling application that allows users to design and fabricate 3D printed electronic products by placing modules on a substrate, generating electrically conductive interconnects, and communicating instructions to manufacturing apparatus, using a library of modules and rulesets to ensure compliance with fabrication, material, and module compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If current methods of integrating 3D printed structures with electronics are used, then electronics can be integrated with 3D printed structures, but the complexity and expense requirements increase
Solution Approach 1:
The patent segments the electronic product into modular components (electronic modules, substrates, housings) that can be independently designed, manufactured, and assembled. This modular approach simplifies the integration process by breaking down the complex task of combining electronics with 3D printed structures into manageable segments with standardized interfaces.
Solution Approach 2:
The patent creates universal substrate designs and standardized module interfaces that can accommodate multiple different electronic modules. This universality allows the same 3D printed substrate to work with various electronic components, reducing overall system complexity and enabling reuse across different product configurations.
2Adaptability or versatility
If current methods of integrating 3D printed structures with electronics are used, then electronics can be integrated with 3D printed structures, but the expense requirements increase
Solution Approach 1:
The patent merges multiple manufacturing operations into integrated workflows. The software platform combines module placement, interconnect routing, substrate design, and manufacturing instruction generation into a unified process, eliminating the need for separate expensive tools and services for each step.
Solution Approach 2:
The patent enables users to perform substrate design and manufacturing planning themselves through the software platform, eliminating the need for expensive professional design services. The automated routing algorithms and manufacturing instruction generators allow end-users to create professional-quality designs without specialized expertise.
3Productivity
If automated routing of electrically conductive interconnects is implemented, then interconnect routing efficiency improves, but computational complexity increases
Solution Approach 1:
The patent implements automated routing for critical interconnects while allowing manual adjustment for less critical connections. The system performs partial automation, focusing computational resources on routing paths that benefit most from optimization while leaving simpler routes to manual configuration.
Solution Approach 2:
The software platform acts as an intermediary between the user's design intent and the final routed configuration. It provides automated routing algorithms that generate initial routes, which users can then review and adjust, combining the efficiency of automation with the flexibility of manual control.
Data Source
AI summary
Systems, media, and methods for modeling electronic products for 3D printing including providing a library of modules and module interfaces; receiving at least one ruleset; receiving preliminary substrate structure data, the preliminary substrate structure data comprising shape and volume data defining a substrate; providing an interface allowing the user to place one or more modules on the substrate; providing an interface allowing the user to place one or more module interfaces, the module interfaces coupling one or more modules together through the substrate; warning the user where placement of a module or module interface violates the at least one ruleset; generating routing of electrically conductive interconnects between placed module interfaces; and generating a finalized substrate structure model by combining the preliminary substrate structure data with module placement data and interconnect routing data.