Modular Active Inductor Using CMOS Cells for High-Q ASIC Integration
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Solution Overview
Problem
Conventional on-chip inductors require large chip size and high power consumption due to low quality factor Q and parasitic resonance, making them costly and inefficient for high-speed communication circuits, while existing active inductors often require customized designs and individual tuning, which is impractical for flexible and cost-effective solutions.
Innovation Solution
A modular active inductor module composed of two MOSFET devices, two capacitors, and one resistor, utilizing deep-trench capacitors and polysilicon resistors, allowing for flexible connections in series or parallel configurations to achieve a wide range of inductances with high quality factor Q and low parasitic resistance, compatible with existing CMOS process integration techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional on-chip inductors are used, then inductance function is provided, but chip area increases and power consumption increases due to low quality factor Q
Solution Approach 1:
The active inductor is divided into multiple modular units that can be independently designed and combined. Each module contains specific CMOS circuit elements (transistors, capacitors, resistors) that can be replicated and connected in series or parallel to achieve desired inductance values and quality factors without increasing overall chip area proportionally
Solution Approach 2:
The modular active inductor design serves multiple functions: it provides inductance, achieves high quality factor Q, reduces chip area, and enables flexible configuration for different applications. The same basic module can be used in various configurations (series, parallel, combinations) to meet different design requirements
2Reliability
If conventional on-chip inductors are used, then inductance function is provided, but power consumption increases due to low quality factor Q
Solution Approach 1:
By segmenting the inductor into modular active units, each module can be optimized for power efficiency. The modular structure allows selective activation and configuration, reducing overall power consumption while maintaining high quality factor Q through optimized CMOS circuit design within each module
Solution Approach 2:
The patent replaces passive mechanical/physical inductor structures with active CMOS electronic circuits. This substitution enables dynamic control, lower power consumption, and higher quality factors by using transistor-based active elements instead of passive spiral inductors that suffer from parasitic losses
3Adaptability or versatility
If customized active inductor designs are created for each application, then specific inductance requirements are met, but design complexity and tuning cost increase
Solution Approach 1:
The inductor is segmented into standardized modular units with defined characteristics. These modules can be systematically combined in series or parallel configurations to achieve various inductance values, eliminating the need for complete custom designs for each application and reducing design complexity while maintaining adaptability
Solution Approach 2:
A universal modular module is designed that can serve multiple applications through different configurations. The same basic module type can be used across different designs by changing the number of modules and their connection topology, providing inductance customization without increasing design and tuning complexity
4Adaptability or versatility
If multiple active inductor circuits of various sizes are built, then different inductance values are achieved, but circuit size and tuning cost become impractical
Solution Approach 1:
Instead of designing entirely different circuits for various inductance values, the system segments the inductor into reusable modular units. This allows a single fabrication process to produce modules that can be combined in different quantities and configurations to achieve various inductance values, dramatically improving fabrication efficiency while maintaining adaptability
Solution Approach 2:
A universal module design enables one fabrication process to serve multiple inductance requirements. The same module can be used in series configurations for higher inductance or parallel configurations for lower inductance, providing a wide inductance range from a single production line, thus improving productivity
Data Source
AI summary
An apparatus and method for manufacturing low-cost high-density compact active inductor module using existing DRAM, SRAM and logic process integration. The elements of the active inductor modules are formed by three semiconductor devices including nMOS devices, deep-trench capacitors and a polysilicon or TaN resistor. The active inductor modules can be connected in a parallel and/or serial configuration to obtain a wide range of inductance values. The modular active inductors can be advantageously stored in an ASIC library to facilitate a flexible and convenient circuit design.