Modular Airtight Carrier Assembly for Large-Volume Load Support

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Solution Overview

Problem

Existing large-sized carriers face limitations due to size constraints imposed by injection molding machines, leading to deformation and mechanical weakness, especially when the carrier and load weight exceed 100 kg, necessitating frequent replacements.

Innovation Solution

A modularized large-sized carrier design comprising multiple body modules connected peripherally, hermetic seals, and a back board, with reinforcement grooves and elements, allowing continuous expansion in depth and enhanced structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the size of the carrier is increased to expand storage capacity, then the volume and storage space are improved, but the base surface deforms and bends due to insufficient mechanical strength

Engineering Contradiction:
Improvecarrier storage volumeVSAvoidbase mechanical strength
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The carrier body is divided into multiple modular segments that can be connected together. This segmentation allows the carrier to achieve large storage volume through modular assembly while each individual module maintains sufficient mechanical strength and structural integrity, preventing base deformation even when the overall carrier size is large.

Inventive Principle:
Principle #1Segmentation

2Volume of moving object

If the carrier size is increased beyond injection molding machine capabilities, then the storage capacity is improved, but the manufacturing feasibility deteriorates

Engineering Contradiction:
Improvecarrier storage volumeVSAvoidmanufacturing feasibility
Core Design Contradiction:
Volume of moving objectVSEase of manufacture

Solution Approach 1:

The carrier is designed as a assembly of multiple modular components rather than a single integrated piece. This segmentation enables manufacturing of individual modules within the capacity limits of existing injection molding machines, while the final assembled carrier achieves the desired large storage volume that would be impossible to manufacture as a single piece.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple separately manufactured modular components are combined through connection mechanisms to form the complete carrier assembly. This merging approach allows each component to be manufactured within machine size limitations while the combined assembly achieves the required large storage capacity.

Inventive Principle:
Principle #5Merging (Combining)

3Weight of moving object

If the carrier weight and load weight exceed 100 kg, then the load capacity is improved, but the base deformation increases due to insufficient support

Engineering Contradiction:
Improvecarrier load capacityVSAvoidbase structural stability
Core Design Contradiction:
Weight of moving objectVSStability of the object's composition

Solution Approach 1:

The carrier body is segmented into multiple modules with distributed connection points and support structures. This segmentation allows the weight and load to be distributed across multiple connection interfaces and support elements, preventing concentration of stress that would cause base deformation while maintaining the ability to carry heavy loads up to and exceeding 100 kg.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The carrier utilizes composite material construction combining different materials with complementary properties. This composite approach enhances the strength-to-weight ratio and structural stability of the base, enabling the carrier to support heavy loads exceeding 100 kg without experiencing base deformation or bending.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS20250273494A1Modularized large-sized carrier
Publication Date: 2025.08.28 GUDENG PRECISION IND CO LTD
  • US20250273494A1 patent drawing
  • US20250273494A1 patent drawing
  • US20250273494A1 patent drawing

AI summary

A modularized large-sized carrier includes at least two body modules, at least one hermetic seal component and a back board. The body modules are connected to each other peripherally and arranged in a depth direction. The hermetic seal component surrounds junctions of the body modules. The back board is disposed behind the last one of the body modules. The modularized large-sized carrier overcomes existing carrier size limitations otherwise caused by injection molding machines and continuously expands in the depth direction to thereby enlarge the airtight storage space of the carrier.