Modular Assembly Stacking Circuit Boards for Thermal Management

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Solution Overview

Problem

Existing circuit board housings are limited in the number of boards they can accommodate due to their fixed size, restricting expandability and efficiency.

Innovation Solution

A modular assembly comprising multiple housing parts with internal connecting means, a cover element, and a closing element, allowing for stacking and expansion by adding more housing parts, with features like heat dissipation and secure connections through spacers, heat pipes, and ventilation ducts for enhanced performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a housing is constructed from two housing parts with limited size, then the structure is simple and easy to manufacture, but the number of circuit boards that can be received is limited

Engineering Contradiction:
Improvenumber of circuit boardsVSAvoidhousing structure
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The housing is divided into multiple modular housing parts (first housing part, second housing part, etc.) that can be stacked vertically. Each housing part contains a base plate, side walls, and a rear wall, forming independent modules that can be assembled together to create a multi-level structure for receiving multiple circuit boards.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The housing structure transitions from a two-dimensional single-layer design to a three-dimensional multi-level stacked configuration. By utilizing the vertical dimension through stacking housing parts, the system accommodates more circuit boards without increasing the horizontal footprint, effectively solving the space limitation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Stability of the object's composition

If housing parts are stacked to form complete side walls and rear walls, then the structural stability is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improvestructural stabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The complete side walls and rear walls are segmented into portions belonging to different housing parts. Each housing part contains partial side walls and a rear wall that, when stacked, form complete continuous walls. This segmentation allows independent manufacturing of standardized modules while achieving structural stability through their assembled configuration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple housing parts are merged through stacking and connecting mechanisms (such as spacers and holding apparatus) to form a unified stable structure. The individual rear walls combine to form a complete rear wall, and side walls combine to form complete side walls, creating structural stability equivalent to or greater than a monolithic housing.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If base plates are connected to side walls and rear walls using spacers and holding apparatus, then the connectivity and thermal management are improved, but the device complexity increases

Engineering Contradiction:
ImproveconnectivityVSAvoidconnection mechanism
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Spacers serve as intermediary elements between the base plates and the side walls/rear walls. These spacers provide mechanical connection and positioning, ensuring stable attachment of housing parts while maintaining thermal pathways. The holding apparatus on the base plate works with the spacers to secure the connection without requiring complex fastening mechanisms.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the accommodation of multiple circuit boards in a cost-effective manner, improving thermal management and connectivity while maintaining structural stability and expandability.

Implementation Method 1

at least one inner-lying base plate is thermally connected by means of at least one heat pipe to a further outer-lying base plate

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

Ventilation ducts are provided in the housing parts for allowing air to flow around the circuit boards

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS10104791B2Modular assembly
Publication Date: 2018.10.16 DIEHL AEROSPACE GMBH
  • US10104791B2 patent drawing
  • US10104791B2 patent drawing
  • US10104791B2 patent drawing

AI summary

The invention relates to a modular assembly that comprises at least two housing parts (1), in which in each case a circuit board (L) is received, at least one internal connecting means (17), one cover element and one closing element. Each housing part (1) is formed from a base plate (3), a rear wall (5) and side walls (4) that are connected to said rear wall. The housing parts (1) are stacked in such a manner that the side walls (4) combine to form a first (6) and a second complete side wall (7), and that the rear walls (5) combine to form a complete rear wall (8). At least two of the housing parts (1) are stacked in such a manner that the base plate (3) of the one housing part (1) is connected to the side walls (4) of the other housing part (1). The at least one internal connecting means (17) extends in a direction perpendicular to the base plates (3) and connects multiple circuit boards (L) by way of first connectors (18). The cover element lies on the side walls (4) of precisely one housing part (1). The closing element is attached to a front side on the housing parts (1), said front side lying opposite the complete rear wall (8).