Modular Computing Device Backplane with Capacitive Interface
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing mobile devices lack a modular and flexible architecture that allows for easy customization and integration of various components without the need for a physical enclosure, limiting their functionality and versatility.
Innovation Solution
A computing device with a backplane that supports user-removable modules, enabling power transfer and communication between modules, and allowing for modular configurations without a physical housing, using a grid system with rails to accommodate different module sizes and orientations, and securing modules via electro-permanent magnets or mechanical mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a physical enclosure is used to house components, then device structure is stable and protected, but device flexibility and customization capability deteriorate
Solution Approach 1:
The device is divided into separate functional modules (display module, camera module, battery module, etc.) that can be independently selected and configured. Each module has standardized interface blocks with capacitive pads for data transfer and power contact pads, allowing modular assembly without a fixed physical enclosure.
Solution Approach 2:
The interface blocks are designed with universal capacitive pads and contact pads that can work with different module types. The same interface structure supports various functionalities (display, camera, power) through different module configurations, eliminating the need for custom enclosures for each function.
2Reliability
If ground contact pad is positioned closer to insertion contact surface, then grounding is established first for safety, but manufacturing precision requirements increase
Solution Approach 1:
The ground contact pad is positioned closer to the insertion contact surface so that grounding is established before power contact during module insertion. This preliminary grounding ensures safety by preventing electrostatic discharge or power surges before the module is fully connected.
Solution Approach 2:
The ground contact pad is made larger than the power contact pad and positioned asymmetrically closer to the insertion surface. This asymmetric design provides both safety (earlier grounding) and manufacturing tolerance compensation, as the larger ground pad area allows for greater alignment variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables modular customization of devices, providing a flexible and versatile platform for integrating various functionalities, such as display, communication, and power modules, while maintaining a compact form factor and efficient power management.
Implementation Method 1
securing modules via electro-permanent magnets or mechanical mechanisms
Implementation Method 2
multiple capacitive pads that each include data contacts to enable data transfer
Implementation Method 3
a power contact pad to provide or receive power
Data Source
AI summary
Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.