Modular Backplane PCB Layout for Signal-Integrity Automation I/O
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Solution Overview
Problem
Existing modular automation systems require repeated layout and error-checking of backplane bus routing, leading to increased costs due to specific impedance and high-frequency behavior specifications, and necessitate separate development and testing for each module variant, which complicates signal integrity and increases production costs.
Innovation Solution
A modular automation system with a backplane bus board in a layered structure, pre-designed and tested for signal integrity, is integrated with a main board and module base, allowing for existing modules to be used across different applications, reducing development and production costs, and ensuring signal integrity through precise impedance calculation and geometric considerations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If backplane bus routing is repeatedly laid out and error-checked for each module variant, then signal integrity specifications (impedance and high-frequency behavior) are met, but development costs and production complexity increase significantly
Solution Approach 1:
The system is divided into a standardized backplane bus board with pre-defined routing and impedance characteristics, and modular I/O modules that can be independently configured. The backplane bus board is segmented into standard connection points that maintain consistent signal integrity across different module configurations.
Solution Approach 2:
The backplane bus board is pre-designed and pre-tested with standardized impedance and high-frequency characteristics before module assembly. This preliminary action ensures signal integrity requirements are met before modules are installed, eliminating the need for repeated routing checks for each module variant.
2Reliability
If separate protective measures are implemented for each module variant, then reliability is improved, but manufacturing costs and production time increase
Solution Approach 1:
The backplane bus board serves multiple functions: it provides standardized electrical connections, ensures signal integrity through pre-designed impedance routing, and offers fault tolerance through its standardized architecture. This universal design eliminates the need for separate protective measures for each module variant.
3Adaptability or versatility
If multiple module types are developed to cover different applications, then adaptability is improved, but device complexity and development costs increase
Solution Approach 1:
A single standardized module type can be used across different applications by configuring which connector elements are populated on the backplane bus board. The standardized interface and connection means allow the same module design to serve multiple application-specific purposes, reducing the need for multiple specialized module variants.
4Adaptability or versatility
If custom circuit boards with application-specific interfaces are used, then adaptability to specific applications is improved, but manufacturing complexity and testing requirements increase
Solution Approach 1:
The system separates the standardized backplane bus board with pre-designed routing from the application-specific module configurations. This segmentation allows the backplane to be manufactured once with standardized interfaces, while application-specific adaptations are achieved through module selection and connector population rather than custom circuit board fabrication.
Data Source
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AI summary
The invention relates to a modular automation system (1) comprising: - a main unit (IM) with a bus connector (10), - a plurality of modules (EA) each with a bus connector (2) and a signal connector (3), - a backplane bus board (RP1, RP2, RP3) in a layered structure with bus conductors (BL1,..., BL4) is connected to a plurality of module connectors (211,..., 234) in which the bus connectors (2) of the modules (EA) are arranged, - a main board (HP) on which a plurality of connector elements (312,..., 334) are arranged, wherein the signal connectors (3) of the modules (EA) are arranged in the connector elements (312,..., 334) and the connector elements (312,..., 334) are electrically in contact with conductors (L1,..., L8) of the main board (HP). stand, - whereby the bus ladder tracks (BL1,...,BL4) and the layer structure of the backplane bus board (RP1,RP2,RP3) are designed such that a layer stack (PCB) comprising the bus conductors (BL1,...,BL4) and core material (PP) contains features that are necessary to maintain the signal integrity of the signals on the backplane bus board (RP1,RP2,RP3) and thus, with regard to the signal integrity of the signals on the backplane bus board (RP1,RP2,RP3), this is arranged separately on the main board (HP).