Modular Base Layer Architecture for Computing Device Connectivity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-performance and high-bandwidth computing devices face connectivity overhead between chips and logic/memory dies despite advancements in chip packages and printed circuit boards (PCBs).
Innovation Solution
A PCB-less computing device architecture utilizing optical base layers, power base layers, and thermal base layers to transmit signals, power, and manage heat, along with compact pluggable modules for scalability and reliability, reduces cabling and maintenance costs while enhancing efficiency and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional PCBs are used to interconnect chips and logic/memory dies, then connectivity between components is achieved, but connectivity overhead and device complexity increase
Solution Approach 1:
The patent segments the monolithic PCB into multiple functional base layers (optical base layer, power base layer, thermal base layer) that can be independently designed, manufactured, and optimized. Each base layer handles specific functions, reducing the complexity of any single layer while maintaining overall system connectivity.
Solution Approach 2:
The patent replaces traditional electrical signal transmission through PCB traces with optical signal transmission through the optical base layer. This substitution reduces electrical interference, signal loss, and connectivity overhead while improving bandwidth and performance.
2Productivity
If high-performance computing devices include large number of high-speed signals, then processing power increases, but connectivity overhead and maintenance costs increase
Solution Approach 1:
The base layers are designed as universal, standardized interfaces that can accommodate different chip types, configurations, and future upgrades. This modular approach allows high-performance computing devices to be assembled with standardized components, reducing maintenance costs and improving ease of manufacture.
Solution Approach 2:
By replacing electrical PCB traces with optical base layers, the system achieves higher signal integrity and reduced interference for large numbers of high-speed signals. The optical interface is more reliable and requires less maintenance, reducing overall maintenance costs while supporting higher processing power.
3Productivity
If chip packages and PCBs are advanced to increase efficiency, then performance improves, but connectivity overhead persists
Solution Approach 1:
The patent replaces the electrical transmission medium (PCB traces) with an optical transmission medium (optical base layer). This fundamental substitution eliminates many sources of electrical interference, signal degradation, and connectivity overhead that persist even in advanced PCB designs, while maintaining improved efficiency.
Solution Approach 2:
The patent transitions from two-dimensional PCB trace routing to a three-dimensional optical base layer structure with multiple layers and routing paths. This dimensional change allows for more efficient signal routing, reduced interference, and lower connectivity overhead while maintaining high performance.
Data Source
AI summary
A computing device, comprising: a chassis; an optical base layer, including optical connectors; a power base layer, including power connectors; a thermal base layer, including a cold supply line with liquid disconnects, hot return lines with liquid disconnects, and thermal infrastructure interfaces; a radio frequency base layer, including radio frequency connectors; a power interface, wherein the power interface connects to the power base layer; a power supply to connect to the power interface and provide power to the power base layer through the power interface; and bays defined by bay divider walls, wherein each bay divider wall is removable and each bay comprises one of the optical connectors, one of the power connectors, one liquid disconnect for the supply line, one of the liquid disconnects for a hot return line, and one of the radio frequency connectors.