Modular Battery Electronics Enclosure With Lightweight EMI Shielding

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Solution Overview

Problem

Existing battery pack enclosures are inefficient, heavy, and lack effective electromagnetic interference (EMI) protection and grounding, which affects the reliability and serviceability of electric vehicles.

Innovation Solution

A modular electronic component enclosure formed from lightweight insulating materials with conductive layers and grounding structures, providing EMI protection and mechanical/electrical coupling to battery packs, with an access panel for serviceability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional metal enclosures are used for battery pack electronic components, then EMI protection and grounding are improved, but the mass and weight of the enclosure increase

Engineering Contradiction:
ImproveEMI protection and groundingVSAvoidenclosure weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The enclosure uses a composite structure combining non-conductive plastic material with conductive elements (metal layers, conductive coatings, or conductive resin). The plastic base provides structural integrity and insulation, while the integrated conductive components provide EMI protection and grounding without requiring a full metal enclosure, thus reducing overall weight while maintaining reliability.

Inventive Principle:
Principle #40Composite materials

2Weight of moving object

If the enclosure is formed from insulating materials, then the weight is reduced, but EMI protection and grounding capabilities deteriorate

Engineering Contradiction:
Improveenclosure weightVSAvoidEMI protection and grounding
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

Instead of making the entire enclosure conductive, the invention applies conductive properties locally only where needed - specifically on the interior surfaces facing electronic components for EMI protection, and at specific grounding points. This localized approach provides necessary EMI shielding and grounding while keeping the majority of the enclosure structure lightweight and insulating.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The conductive layers, coatings, or resin act as intermediary elements between the insulating plastic enclosure and the electronic components. These intermediaries provide the necessary conductive path for EMI protection and grounding without requiring the main enclosure structure to be conductive, thus maintaining the weight advantage of plastic while achieving EMI compliance.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If the enclosure is made as a single integrated unit, then manufacturing is simplified, but serviceability of electronic components deteriorates

Engineering Contradiction:
Improveenclosure manufacturingVSAvoidelectronic component serviceability
Core Design Contradiction:
Ease of manufactureVSEase of repair

Solution Approach 1:

The enclosure is segmented into modular components including a main enclosure body and a separate access panel. The access panel can be independently removed to provide service access to electronic components, while the main enclosure body retains the integrated conductive EMI shielding structure. This segmentation enables both ease of manufacture for the main structure and ease of serviceability through the removable panel.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The access panel serves multiple functions: it provides structural closure to the enclosure, maintains EMI shielding when attached, and enables serviceability when removed. This multi-functional design allows a single component to address manufacturing simplicity, EMI protection, and serviceability requirements simultaneously.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the efficiency, serviceability, and reliability of electric vehicles by reducing weight and improving EMI protection and grounding, thereby mitigating greenhouse gas emissions.

Implementation Method 1

The enclosure may be lined or coated with a conductive material, such as a foil, a coating, or a resin, to provide electromagnetic interference (EMI) protection and/or electromagnetic compatibility (EMC) properties

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

The enclosure may also include one or more metal layers and/or features, on or attached to a bottom plate of the enclosure, for grounding purposes

Methodology Applied
Scientific EffectElectrical grounding: Earthing

Data Source

PatentUS20250262927A1Modular electronic component enclosure
Publication Date: 2025.08.21 RIVIAN HOLDINGS LLC
  • US20250262927A1 patent drawing
  • US20250262927A1 patent drawing
  • US20250262927A1 patent drawing

AI summary

Aspects of the subject disclosure relate to an enclosure for one or more electrical components for a battery pack. The enclosure may be configured to mechanically and electrically couple to an energy volume of the battery pack. The enclosure may include an access panel. The access panel may be formed from a solid insulating structure configured to at least partially cover the one or more electrical components, and a conductive layer on a surface of the solid insulating structure. The enclosure may be a modular enclosure that can be used to provide electrical connection to any of various energy volumes including batteries or battery cells of any of various cell chemistries.